The photoacoustic (PA) technique is one of many techniques for characterizing thermal conductivity of materials, including thermal interface conductance or resistance. Compared with other techniques, the PA method is relatively simple, yet is able to provide accurate thermal conductivity data over a wide range of materials and properties. In the last decade, the PA method has been developed and...

An assessment of uncertainties for the National Institute of Standards and Technology (NIST) 1016 mm Guarded-Hot-Plate apparatus is presented. The uncertainties are reported in a format consistent with current NIST policy on the expression of measurement uncertainty. The report describes a procedure for determination of component uncertainties for thermal conductivity and thermal resistance for...

This paper addresses the differences in thermal characterization and modeling for a multi-chip package with respect to a single-chip package. Since no thermal measurement system is commercially available to power more than one device during the test, the thermal model can be validated only with a single-heat source. Wires, which are used to connect the package under the test to the measurement ...

This work reports on the development of a Johnson noise electro-thermal (JET) technique to directly characterize the thermal conductivity of one-dimensional micro-/nanoscale materials. In this technique, the to-bemeasured micro-/nanoscale sample is connected between two electrodes and is subjected to steady-state Joule heating. The average temperature rise of the sample is evaluated by simultan...

Evaporative resistance has been widely used to describe the evaporative heat transfer property of clothing. It is also a critical variable in heat stress models for predicting human physiological responses in various environmental conditions. At present, sweating thermal manikins provide a fast and cost-effective way to determine clothing evaporative resistance. Unfortunately, the measurement r...

The reliability of microelectronic devices is largely dependent on electronic packaging, which includes heat removal. The appropriate packaging design therefore necessitates precise knowledge of the relevant material properties, including thermal resistance and thermal conductivity. Thin materials and high conductivity layers make their thermal characterization challenging. A steady state measu...

Thermal adhesives that contain large concentrations of high thermal conductivity filler materials, such as ceramics or metals, are widely used by the electronics industries in a variety of applications. The thermal properties of these materials, such as the thermal contact resistance across a bonded joint and the thermal conductivity of the bulk material, are critical to the selection of the “b...