One of major reasons of failure of solder joints is known as the thermal fatigue. Also, The failure of the solder joints under the thermal fatigue loading is influenced by varying boundary conditions such as the material of solder joint, the materials of substrates(related the difference in CTE), the height of solder, the Distance of the solder joint from the Neutral Point (DNP), the temperatur...

Photon absorbers, masks, and shutters of the third-generation light sources are subjected to intense thermal stress cycles from the high intensity x-ray beams. A collaborative research study is underway at APS and ESRF to establish thermal fatigue design criteria for Glidcop® Al-15, which is commonly used for high-heat-load components. A nonlinear finite element methodology is used for modeling...

A solder fatigue model for the 63Sn/Pb solder alloy has been previously introduced which characterizes the creep fatigue phenomena of the solder by combining nonlinear finite element modelling with experimental thermal fatigue lives of various flip chip assemblies. The model correlates the amount of creep strain energy dissipated per thermal cycle with the characteristic Weibull life of the cri...

Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The mechanism of substrate flexibility on improving solder joint thermal fatigue was investigated by thermal mechanical an...

Thermal fatigue of Cu interconnects 60 nm thick and 5–15 lm wide was investigated by using alternating current to generate cycling temperature and strain/stress. The fatigue curves exhibit two regions, i.e. highand low-cycle regions, which correspond to low and high thermal strains, respectively. The high-cycle region is found to be controlled by an unusual thermal fatigue mechanism of damage b...

Finite element simulations are carried out to characterize a new fracture specimen, consisting of an outer circular epoxy ring bonded to an inner circular invar plate for accelerated thermal fatigue testing. Radial cracks are introduced in the epoxy ring. The growth of these radial cracks is correlated to the applied energy release rate G. We studied the dependence of G on the crack length, the...