The thermal cycling stress method is popularly used to study the thermal mechanical effect on metallization films in VLSI applications, specially in interconnect systems of power IC. The fast thermal cycling stress method reported in this paper has several advantages compared with using a conventional oven for thermal stress. A special test chip is designed to demonstrate the application of thi...

Life time of electronic products is often limited by competing failure mechanisms brought on by the product’s use and its surrounding environment. Solder interconnect failure is a known life limiting failure mechanism that is induced by repeated temperature excursions. Thermal fatigue reliability of solder is conventionally assessed by simple temperature cycling tests, which apply a constant te...

Easy-to-use thermal cycling for performing rapid and small-volume DNA amplification on a single chip has attracted great interest in the area of rapid field detection of biological agents. For this purpose, as a more practical alternative to conventional continuous flow thermal cycling, liquid plug-flow thermal cycling utilizes a thermal gradient generated in a serpentine rectangular flow micro...

We have compared aging phenomena in the Fe0.5Mn0.5T iO3 Ising spin glass and in the CdCr1.7In0.3S4 Heisenberg-like spin glass by means of lowfrequency ac susceptibility measurements. At constant temperature, aging obeys the same ‘ωt scaling’ in both samples as in other systems. Investigating the effect of temperature variations, we find that the Ising sample exhibits rejuvenation and memory eff...

In two-phase TiAl-based alloys, the coexisting 2 and phases exhibit a thermal expansion mismatch, so that increased creep rates during thermal cycling may be expected. Creep deformation of two g-TiAl-based alloys was investigated during thermal cycles between 900 and 300 or 350 C with applied tensile stresses of 32.5 or 37.0 MPa. Measured thermal cycling creep rates were compared with isotherma...

One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in si...

This study investigated the residual tensile properties of plain woven jute fiber reinforced poly(lactic acid) (PLA) during thermal cycling. Temperature ranges of thermal cycling tests were 35-45 °C and 35-55 °C. The maximum number of cycles was 10³ cycles. The quasi-static tensile tests of jute fiber, PLA, and composite were conducted after thermal cycling tests. Thermal mechanical analyses of...

 In this research, a numerical modeling was utilized to calculate the stresses caused during thermal cycling in a functionally graded thermal barrier coating (FG - TBC). The temperature – dependent material response of this protective material was taken into account and the effects of thermal cycle and interface morphology of the ceramic / metallic layer in functionally graded coating system wa...

In this paper, we present a comparative study that focus on Supercapacitor (SC) thermal cycling and calendar ageing under constant voltage tests. The impacts of cycling temperature on SC performance and degradation rate are studied. Obtained results from thermal cycling ageing test are compared with those coming from simple calendar ageing test at constant voltage and constant temperature. The ...

The purpose of this study was to evaluate the effect of thermal cycling on the surface texture of restorative materials. Disk-shaped specimens made of seven resin composites (Beautifil: BF; Esthet-X: EX; Filtek Supreme: FS; Inten-S: IS; Point 4: PT; Solare: SR; and Venus: VS) were finished with 1-microm alumina suspension, and then thermocycled between 4 and 60 degrees C in distilled water for ...