This in vitro study compared the shear bond strength (SBS) and adhesive remnant index (ARI) of two systems for bonding orthodontic brackets to enamel. The first system involved a self-etching primer (Beauty Ortho Bond, BO) containing surface pre-reacted glass filler. The second involved a primer applied with phosphoric acid etching (Transbond XT, TX). Ninety-six extracted human premolars were d...

Understanding the lattice dynamics and low thermal conductivities of IV-VI, V2-VI3 and V materials is critical to the development of better thermoelectric and phase-change materials. Here we provide a link between chemical bonding and low thermal conductivity. Our first-principles calculations reveal that long-ranged interaction along the 〈100〉 direction of the rocksalt structure exist in lead ...

Article history: Received 30 May 2012 Accepted 24 June 2012 Available online 12 August 2012 0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.087 ⇑ Tel.: +81 52 612 6111; fax: +81 52 612 5623. E-mail address: [email protected] A power semiconductor module using a bonding film with anisotropic thermal conduction has been studied. The bonding fil...

We present a thermally activated solvent bonding technique for the formation of embedded microstructures in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the b...

Rhodopsin has developed mechanisms to optimize its sensitivity to light by suppressing dark noise and enhancing quantum yield. We propose that an intramolecular hydrogen-bonding network formed by ∼20 water molecules, the hydrophilic residues, and peptide backbones in the transmembrane region is essential to restrain thermal isomerization, the source of dark noise. We studied the thermal stabili...

In this work we present a novel thermal bonding method for thermoplastic microfluidic devices. This simple method employs a modified vacuum bagging technique, a concept borrowed from the aerospace industry, to produce conventional thick substrate microfluidic devices, as well as multi-layer film devices. The bonds produced using this method are superior to those obtained using conventional ther...

Thermally reduced graphene nanoplatelets were covalently functionalised via Bingel reaction to improve their dispersion and interfacial bonding with an epoxy resin. Functionalised graphene were characterized by microscopic, thermal and spectroscopic techniques. Thermal analysis of functionalised graphene revealed a significantly higher thermal stability compared to graphene oxide. Inclusion of ...

An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC)...

The aim of this investigation was to evaluate the metal-ceramic bonding of Au-1.6 wt% Ti alloy. Therefore, the coefficient of thermal expansion, modulus of elasticity, ceramic bonding strength, and hardness of Au-1.6 wt% Ti alloy were measured. The metal-ceramic interface was observed by EPMA to investigate its bonding mechanism. The Au-1.6 wt% Ti alloy showed a coefficient of thermal expansion...