نتایج جستجو برای: suit etching depth

تعداد نتایج: 179050  

B. A. Ganji, B. Yeop Majlis,

Abstract: In this paper, a DRIE process for fabricating MEMS silicon trenches with a depth of more than 250 m is described. The DRIE was produced in oxygen-added sulfur hexafluoride (SF6) plasma, with sample cooling to cryogenic temperature using a Plasmalab System 100 ICP 180 at different RF powers. A series of experiments were performed to determine the etch rate and selectivity of the some m...

2014
Jian Guo Bingjun Yu Xiaodong Wang Linmao Qian

A new fabrication method is proposed to produce nanostructures on monocrystalline silicon based on the friction-induced selective etching of its Si3N4 mask. With low-pressure chemical vapor deposition (LPCVD) Si3N4 film as etching mask on Si(100) surface, the fabrication can be realized by nanoscratching on the Si3N4 mask and post-etching in hydrofluoric acid (HF) and potassium hydroxide (KOH) ...

2015
W H Arnold B. Haddad K. Schaper K. Hagemann C. Lippold Gh. Danesh

BACKGROUND The aim of this study was to investigate the influence of etching time with 15% hydrochloric acid (HCl) on the enamel surface destruction by studying the resulting roughness and erosion depth. METHODS The vestibular surfaces of 12 extracted, caries free human incisors were divided into four quadrants, and each quadrant was etched with 15% HCl for different numbers of etching cycles...

2014
Shiva Alavi Reza Birang Fatemeh Hajizadeh Hamed Banimostafaee

BACKGROUND The aim of this study was to compare the effects of conventional acid etching and laser etching on the nano-mechanical properties of the dental enamel using nano-indentation test. MATERIALS AND METHODS In this experimental in vitro study, buccal surfaces of 10 premolars were divided into three regions. One of the regions was etched with 37% phosphoric acid and another etched with E...

2004

Presently, we successfully integrated multi-depth DRIE etching, two-poly MUMPs, and bulk releasing to accomplish superior poly-Si micro-optical systems. The stiffness of the devices was significantly increased using the trench-refilled rib structure, so that the radius of curvature (ROC) of the 2μm thick mirror even reached 150mm. In addition, the space between the devices and the substrate was...

2003
Qinjun Peng Shijie Liu Yongkang Guo Bo Chen Jinglei Du Yangsu Zeng Chongxi Zhou

Zheng Cui Rutherford Appleton Laboratory Chilton, Didcot Oxon OX11 0QX United Kingdom Abstract. A new photolithographic technique that combines the advantages of a programmable digital liquid crystal display (LCD) system and projection photolithography system to fabricate arbitrarily shaped microstructures using LCD panels as real-time masks is reported. Its principle and design method are expl...

2005
CIPRIAN ILIESCU KWONG LUCK TAN FRANCIS E.H. TAY JIANMIN MIAO

This paper is a review of wet and dry etching of one of the most common types of glass: Pyrex. The paper analyzes the methods for increasing the glass etch rate in HF solutions, namely, annealing, concentration, ultrasonic agitation and temperature. The limitations of the wet etching of glass are also presented. Mashing layers commonly used for deep wet etching of glass are analyzed, in terms o...

2003
Noriyuki Yokouchi Aaron J. Danner Kent D. Choquette

A vertical-cavity surface-emitting laser ~VCSEL! having a two-dimensional ~2-D! photonic crystal structure on its surface has been investigated for single-lateral-mode operation. We evaluated the effective index change of a VCSEL cavity introduced by a 2-D pattern. Our experimental results showed good agreement with a theoretical model in which the influence of a finite etching depth was taken ...

2014
Christian Heyn Sandra Schnüll David E Jesson Wolfgang Hansen

We describe a method to control the shape of nanoholes in GaAs (001) which combines the technique of local droplet etching using Ga droplets with long-time thermal annealing. The cone-like shape of inverted nanoholes formed by droplet etching is transformed during long-time annealing into widened holes with flat bottoms and reduced depth. This is qualitatively understood using a simplified mode...

Journal: :Computer Physics Communications 2012
A. A. Azooz S. H. Al-Nia'emi M. A. Al-Jubbori

In this work, the empirical parameterization describing the alpha particles’ track depth in CR-39 detectors is extended to describe longitudinal track profiles against etching time for protons and alpha particles. MATLAB based software is developed for this purpose. The software calculates and plots the depth, diameter, range, residual range, saturation time, and etch rate versus etching time. ...

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