we chose Sn10Bi, Sn10Bi10In, Sn20Bi, and Sn20Bi20In (numbers are in weight percent) rapidly solidified from melt using melt-spinning technique for intermediate –step soldering. We then investigated the structure, electrical and mechanical properties of the melt-spun ribbons using x-ray diffraction, double bridge circuit, dynamic resonance technique, and Vickers microhardeness tester. It was con...

Soldering failures lead to considerable manufacturing costs in the electronics assembly industry. Soldering problems can be caused by improper parameter settings during paste stencil printing, component placement, the solder reflow process or combinations thereof in surface mount assembly (SMA). Data mining has emerged as one of the most dynamic fields in processing large manufacturing database...

Soldering of molded case tantalum capacitors can result in damage to Ta2O5 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture co...

Title of Document: CHARACTERIZATION OF FR-4 PRINTED CIRCUIT BOARD LAMINATES BEFORE AND AFTER EXPOSURE TO LEAD-FREE SOLDERING CONDITIONS Ravikumar Sanapala, Master of Science, 2008 Directed By: Chair Professor, Michael G. Pecht, Department of Mechanical Engineering The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher t...

In this paper, I develop the Soldering formalism in a new domain the noncommutative planar gauge field theories. The Soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair o...