The oxy-acetylene torch brazing of copper tubes using silver-based filler metals (Ag-Cu-Zn-Cd) was investigated in this study. Filler containing silver content 15% and 35%, designated by BR15 BR35, were used to assess the influence microstructure mechanical performance brazed joints. joints analyzed means optical microscopy, scanning electron energy-dispersive spectroscopy. microstructures BR35...

Table S1. Host materials and references for Figure 5 in the main text. Reference numbers are those used in the main text. Filler material Host material Reference SWNT PDMS [15] SWNT epoxy [18] SWNT polystyrene [14] SWNT PEDOT-PSS [21] MWNT PDMS [3] MWNT epoxy [17] MWNT polystyrene [11] MWNT polyurethane-urea [10] EG polystyrene [12] EG NBR [5] silver particles PDMS [1] CB polystyrene [16] CB po...

OBJECTIVE A comparative study is made of the histological effects of silver amalgam versus compomer (Dyract) 90 days after placement as retrograde filling materials in experimental animals. METHOD Six Beagle dogs were used, with total pulpectomy and orthograde material filling followed by periapical surgery of the 6 upper and 6 lower incisors (for a total of 72 teeth). Thirty-six teeth corres...

In this work, colloidal silver has been added into an acrylic clear cataphoretic bath, evaluating the effect of two different filler amounts on durability composite coatings. The three series samples were characterized by electron microscopy to assess possible change in morphology introduced silver-based additive. protective properties coatings evaluated a salt spray chamber exposure and electr...

The bidirectional 3[Formula: see text] method is an electrothermal technique that commonly used to obtain the thermal conductivity of materials such as liquids, biological samples, and pastes. In this work, epoxy-based adhesive was filled with monodisperse 10 μm polymethyl methacrylate spheres coated silver thin films (AgPS), a metallic network dominated transport formed through composite. cond...

Thermal underfills are crucial to support integration density scaling of future integrated circuit packages. Therefore, a sequential process using hierarchical selfassembly of microand nanoparticles is proposed to achieve percolating thermal underfills with enhanced particle contacts. The three main process steps hereby are assembly of filler particles by centrifugation, formation of nanopartic...