Objective: Cancer is a major health problem worldwide and current therapies for cancer are often limited by short-term efficacy due to drug resistance. There has been much interest in the use of naturally occurring compounds with chemo-preventive and chemotherapeutic properties in the treatment of cancers. Rose is one of the most important groups of ornamental plants which their fruits and flo...

Background Formaldehyde is a chemical precursor, flammable and colorless which is widely used in different industries. Previous studies, have reported that Formaldehyde has destructive effects on reproductive system of female mice. In the present study we aimed at evaluating the protective effects of Rosa damascene on the toxic effects of Formaldehyde on sex hormones, ovary parameters and folli...

Damask rose (scientific name: Rosa Damascene) belongs to Rosaceae families and is valuable in medicine. In this study, the influence of air temperature and velocity are investigated on hot air dryer of the rose petals. Artificial drying of the agricultural products is one of the most common maintenance procedures. Suitable drying methods reduce the waste and damage during the storage and save t...

Background: Roses have been used since ancient time in rituals, cosmetics, perfumes, medicines and aromatherapy. Turkey, the main rose oil producer in the world, uses R. damascena Mill. for rose oil production. Objective: In this work a comparative survey on chemical composition of essential oils of Rosa damscena Mill. from different locations of Iran has been proposed in industrial scales. ...

We have developed a 3-dimensional computer simulation tool to study the characteristics of microstructure evolution in damascene interconnects. This tool is based on the Monte Carlo method, and the characteristics of the microstructure evolution have a significant impact on the interconnect reliability. Our simulation results show that it may not be possible to obtain a bamboo microstructure th...

We studied the effect of inserting a Ti layer between the Cu and TiN layers on the interconnect resistance and on the resistance toward electromigration (EM) of the damascene interconnects. As a result, it became clear that, by inserting the Ti layer, the adhesion of the Cu to the underlayer could be improved. By inserting the thin Ti layer with atmospheric exposure, we were able to hold down t...