The present paper peruses MEMS based piezoresistive pressure sensor and its fabrication techniques. Simulation of the pressure sensor is done by using COMSOL Multiphysics software for P-type silicon piezoresistor. The deflection of N-type silicon diaphragm depends upon the Young’s modulus of the material and varies with the amount of force applied to the diaphragm. The simulation result emphasi...

This paper reports a CMOS MEMS (complementary metal oxide semiconductor micro electromechanical system) piezoresistive humidity sensor fabricated by a surface micromachining process. Both pre-CMOS and post-CMOS technologies were used to fabricate the piezoresistive humidity sensor. Compared with a bulk micromachined humidity sensor, the machining precision and the sizes of the surface micromach...

Piezoresistive pressure sensors capable of detecting ranges of low compressive stresses have been successfully fabricated and characterised. The 5.5 × 5 × 1.6 mm3 sensors consist of a planar aluminium top electrode and a microstructured bottom electrode containing a two-by-two array of truncated pyramids with a piezoresistive composite layer sandwiched in-between. The responses of two different...

Stimuli-responsive hydrogels can be used to convert miniature pressure sensors into novel chemomechanical sensors via confinement of the hydrogel sample between a porous membrane and a piezoresistive diaphragm. Chemomechanical sensors could prove beneficial in a variety of applications, including continuous monitoring of bioreactors and biomedical systems. In this study, one hydrogel compositio...

Speaker cones and other driver diaphragms are usually too fragile to be good sites for touch interaction. This can be solved by employing new, lightweight piezoresistive e-textiles with flat, rectangular, stiff surfaces used in full-range drivers from HiWave. Good low-frequency performance of piezoresistive fabric has an advantage over piezoelectric sensing for this situation. Applications of t...

For the first time an integrated piezoresistive microsensor, used for monitoring ball bonding, is rigorously simulated. The sensor is based on a CMOS n + -diffusion and located in situ below a standard bonding pad. It measures a value related to the ultrasound stress which is dissipated during ball bonding. We report on a 2D simulation tool based on the implementation of the governing equation ...

The major factor affecting the high performance applications of the piezoresistive pressure sensor is the temperature dependence of its pressure characteristics. The influence due to temperature variation is manifested as a change in the span, bridge resistance, and offset of the sensor. In order to reduce the thermal drifts of the offset and span of the piezoresistive pressure sensor, a Half-B...

We present a new generation of piezoresistive nanomechanical Membrane-type Surface stress Sensor (MSS) chips, which consist of a two dimensional array of MSS on a single chip. The implementation of several optimization techniques in the design and microfabrication improved the piezoresistive sensitivity by 3~4 times compared to the first generation MSS chip, resulting in a sensitivity about ~10...

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology...