Nickel plated copper heat spreader acts as a medium to dissipate heat from silicon die towards heat-sink. Electroless nickel plating requires catalytic activation before the nickel can be deposited onto copper. Different catalytic activation techniques such as galvanic initiation and thin nickel-copper electrodeposition have diverse impact on the thermal performance of the heat spreader. Surfac...

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...

In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...

Capillary zone electrophoresis was used in the analysis of anions and cations in electroless plating bath samples. Examples described in this application note include the analysis of inorganic and organic anions in nickel-plating baths, cations in nickel-iron-cobalt-plating baths and metal-EDTA complexes in plating bath waste. Sample preparation was minimal, consisting merely of diluting the sa...

The pretreatment of the substrate, prior to Electroless Nickel (EN) plating, plays an important role in the corrosion protection provided by the EN deposit. Many factors in the pretreatment process can affect the corrosion resistance of the EN deposit. The details of mechanical treatment, chemical/elecuo polishing, acid activation, and pre-processing procedure (such as nickel strike) are among ...

In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...

despite having some useful properties, stainless steels suffer from lack of suitable surface hardness. in this research electroless ni-b-tl coating was used with the aim to increase their surface hardness. the effects of nickel chloride, sodium borohydride, thallium nitrate and ethylendiamin on the chemical composition of coating were studied. to achieve an increase in hardness, the effects of ...

lectroless nickel plating is a relaE. hvely new technological process. The first laboratory experiments were done in 1944 by A. Brenner and G. Riddelll during World War 11. Public announcements were made a few years later. This work bad been done without knowledge of the earlier observations by Roux in 1916* and by Wurtz3 in 1845. The early work was not successful due to poor quality reagents a...

This work connects the neocybernetic theory of elastic systems to modeling of a complex industrial process. It turns out that using simple mathematics combined with multilinear tools leads to linear models that can be used for monitoring and control. As an application example, electroless nickel plating is studied.