The paper focuses on coarse-grained dynamically reconfigurable array architectures promising performance and flexibility for different challenging application areas, e. g. future broadband mobile communication systems. Here, new and flexible microelectronic architectures are required solving various problems that stem from access mechanisms, energy conservation, error rate, transmission speed c...

The aim of this paper is to summarize the efforts carried out so far in the fabrication of Si-based biosensors by a team of researchers in Catania, Italy. This work was born as a collaboration between the Catania section of the Microelectronic and Microsystem Institute (IMM) of the CNR, the Surfaces and Interfaces laboratory (SUPERLAB) of the Consorzio Catania Ricerche and two departments at th...

There are many techniques available for two-dimensional machining and patterning of semiconductor surfaces for optoelectronic and microelectronic applications. These mainly use photolithography, electron beam or X-ray lithography or reactive ion etching. Smooth surfaces and high-aspect ratio sidewalls can be produced, but they are all limited to creating a single etch depth per processing stage...

The use of implantable microelectronic devices for treatment of medical conditions, e.g. movement disorders, deafness and urinary incontinence has increased steadily over the years [1]. These devices use microelectronic components to sense biological activities in the im‐ planted patient. The microelectronic components must be protected from the surrounding tissue using insulating (hermetic) pa...

Dust particle transport in low-temperature plasmas has received considerable attention due to the desire to minimize contamination of wafers during plasma processing of microelectronic devices and as their use to study nonideal plasmas. Observations of dust particles in radio frequency discharges have shown that particles form Coulomb crystals and display collective behavior. Images are present...

In this paper we present a manufacturable InP/InGaAs SHBT technology suitable for monolithic integration of highdata-rate optical receivers. We investigated the fabricated SHBT and found that they are essentially insensitive to processing variations. The satisfactory device yield and uniform device performance in a research laboratory environment suggested the robustness of InP-based SHBT techn...

We demonstrate through simulations the feasibility of using magnetically coupled nanometer-scale ferromagnetic dots for digital information processing. Microelectronic circuits provide the input and output of the magnetic nanostructure, but the signal is processed via magnetic dot–dot interactions. Logic functions can be defined by the proper placements of dots. We introduce a SPICE macromodel ...

This paper presents an overview of the design of electrochemical processing equipment for semiconductor and related microelectronic manufacturing as well as a review of publications that are applicable to electrochemical wafer process equipment. We discuss several types of electrochemical processes applicable to wafer processing and the considerations that go into automated equipment for these ...

Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a ...