The flow distribution in a silicon microchannel heat sink was studied using Infrared MicroParticle Image Velocimetry (IR PIV). The microchannel test piece consisted of seventy-six 110 m wide  371 m deep channels etched into a silicon substrate. Inlet and outlet manifolds, also etched into the substrate, were fed by 1.4 mm inner-diameter tubing ports. An image processing algorithm was develo...

The present work experimentally investigates the thermal effects of a synthetic jet actuator on the heat transfer performance of single-phase flow confined in a microchannel heat sink. The heat sink consisted of a single rectangular microchannel 500 μm wide, 300 μm deep and 26 mm long. Deionized water was employed as the cooling fluid. A synthetic jet actuator with a 100 μm diameter orifice was...

In this study the performances of various non-circular microchannel heat sinks (normalized with circular shape) have been comparatively analyzed for CuO-water nanofluid and baseline pure water flow. Nusselt number and Poiseuille number for each microchannel and thermo-physical properties of CuO-water nanofluid (viz., thermal conductivity, viscosity, specific heat and density) have been designed...

Title of Document: FORCE FED MICROCHANNEL HIGH HEAT FLUX COOLING UTILIZING MICROGROOVED SURFACES Edvin Cetegen, Doctor of Philosophy, 2010 Directed By: Michael Ohadi, Professor Department of Mechanical Engineering Among other applications, the increase in power density of advanced electronic components has created a need for high heat flux cooling. Future processors have been anticipated to exc...

In this work, single layered (SL) and double layered (DL) flexible microchannel heat sinks are analyzed. The deformation of the supporting seals is related to the average internal pressure by theory of elasticity. It is found that sufficient cooling can be achieved using SL flexible microchannel heat sinks at lower pressure drop values for softer seals. Double layered flexible microchannel heat...

A detailed numerical simulation of forced convection heat transfer occurring in silicon-based microchannel heat sinks has been conducted using a simplified three-dimensional conjugate heat transfer model (2D fluid flow and 3D heat transfer). The micro-heat sink model consists of a 10 mm long silicon substrate, with rectangular microchannels, 57 lm wide and 180 lm deep, fabricated along the enti...