Mn was an important alloying element used in Al-Mg-Mn alloys. However, it had to be limited to a low level (<1.0 wt %) to avoid the formation of coarse intermetallics. In order to take full advantage of the benefits of Mn, research was carried out to investigate the possibility of increasing the content of Mn by studying the effect of cooling rate on the formation of Fe- and Mn-rich intermetall...

The magnesium-rich intermetallic phases RE3RuMg7 (RE = Y, Nd, Dy, Ho) have been synthesized from the elements in sealed niobium ampoules and subsequently characterized by powder X-ray diffraction. The structure of the dysprosium compound was refined on the basis of single-crystal X-ray diffractometer data: Ti6Sn5 type, P63/mmc, a = 1019.1(2), c = 606.76(9) pm, wR2 = 0.0159, 439 F2 values, 19 va...

Introduction Intermetallic compounds (IMCs) are generally considered a bad thing in solder joints, though this is not always the case. Excessive IMCs in solder joints are a bad thing since they significantly alter both the composition and the mechanical performance of the solder joint. Interfacial IMC layers can be an indication of the quality of the solder joint and the lack of them would indi...

Near-net shape forming of metallic components from metallic powders produced in situ from reduction of corresponding pure metal oxides has not been explored to a large extent. Such a process can be probably termed in short as the “Reduction-Sintering” process. This methodology can be especially effective in producing components containing refractory metals. Additionally, in situ production of m...

The past two decades have seen alloys based upon intermetallic phases evolve from the status of scientifically interesting materials with a range of attractive properties, combined with overriding disadvantages, to that of the next generation of advanced engineering alloys. This evolution, which has been achieved through a very significant research and development effort on a world wide front, ...

Optical microscopy was used to discern the different grain orientations and grain boundaries on the polished cross-sections of neareutectic lead-free board-level SnAgCu (SAC) solder interconnects. Strain distributions with submicron accuracy of the deformations on the cross-sections of the solder interconnects were measured when the package was subjected to thermal loading from room temperature...

The present study was performed on A356 alloy [Al-7 wt %Si 0.0.35 wt %Mg]. To that La and Ce were added individually or combined up to 1.5 wt % each. The results show that these rare earth elements affect only the alloy melting temperature with no marked change in the temperature of Al-Si eutectic precipitation. Additionally, rare earth metals have no modification effect up to 1.5 wt %. In addi...