The study focuses on the critical interlayer thickness for averting pore formation during transient liquid phase (TLP) bonding in the Cu–Sn system. Such pores are a consequence of the growth and subsequent contact of Cu6Sn5 intermetallic grains on the two surfaces to be bonded, prior to the formation of the transient liquid phase. A criterion for the critical interlayer thickness is developed, ...

Intermetallide phase formation was studied in a powdered Fe–Al system under layer by layer laser cladding with the aim of fabricating the gradient of properties by means of changing the Fe–Al concentration ratio in the powder mixture from layer to layer. The relationships between the laser cladding parameters and the intermetallic phase structures in the consecutively cladded layers were determ...

In situ X-ray photoelectron spectroscopy (in situ XPS) was used to study the structural and catalytic properties of Pd-In near-surface intermetallic phases in correlation with previously studied PdZn and PdGa.Room temperature deposition of ∼4 monolayer equivalents (MLEs) of In metal on Pd foil and subsequent annealing to 453 K in vacuum yields a ∼1:1 Pd/In near-surface multilayer intermetallic ...

In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The -Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with ...

Electrical and magnetic properties of CeCuGe were investigated through electrical resistivity, thermal conductivity and magnetization measurements in the temperature range 2–300 K. Magnetization measurements indicate a paramagnetic to ferromagnetic transition at TZ10 K, in agreement with previous work. There are two distinct paramagnetic regimes: At high-T the magnetic moment per cerium is 2.50...

Intermetallic compounds have been studied for their potential application as structural wear materials or coatings on engineering steels. In the present work, a newly designed intermetallic composite in a Ni-Mo-Si system was fabricated by arc-melting process with commercially pure metal powders as starting materials. The chemical composition of this intermetallic composite is 45Ni-40Mo-15Si (at...

A kinetic analysis was formulated for electromigration enhanced intermetallic evolution of a Cu–Sn diffusion couple in the Sn-based Pb-free solder joints with Cu under bump metallurgy. The simulated diffusion couple comprised the two terminal phases, Cu and Sn, as well as the two intermetallic phases, Cu3Sn and Cu6Sn5, formed between them. The diffusion and electromigration parameters were obta...

The crystalline Ti50Cu50 ribbon was prepared by annealing its amorphous counterpart at 773K, 84K higher than its crystallization temperature. An equiatomic TiCu intermetallic phase dominated in the matrix coexisting with trace Ti2Cu phase segregated on the grain boundary. A bi-continuous nanoporous copper from tenths of nanometers to hundredths of nanometers was obtained after dealloying the cr...

Fe-Al intermetallic alloys with aluminum content over 60 at% are in the area of the phase equilibrium diagram that is considerably less investigated in comparison to the high-symmetry Fe₃Al and FeAl phases. Ambiguous crystallographic information and incoherent data referring to the phase equilibrium diagrams placed in a high-aluminum range have caused confusions and misinformation. Nowadays une...