this paper presents theoretical and numerical state-of-the-art information in the field of hygro-thermo-mechanical deformation simulation in structural concrete. the aspects discussed include coupled hygro-thermo-mechanical performance of porous materials including concrete, multi-scale simulation of concrete properties especially the volumetric and structural deformation performance, and the m...

Nonlinear behavior of a functionally graded cantilever beam is analyzed under non-uniform hygro-thermal effect. To solve this problem, finite element method is applied within plane solid continua. Total Lagrangian approach is utilized in the nonlinear kinematic relations. Newton-Raphson method with incremental displacement is used in nonlinear solution. Comparison study is performed. Effects of...

This paper presents the results obtained with the simulations of a sandwich rectangular plate made of carbon/epoxy composite when subjected to temperature and humidity cycles. Fickian diffusion process, moisture transport along the interfaces and damage caused by slipping and debonding between the components of the microscopic structure are considered. The application of the design methodology ...

In fibrous paper materials, an exposure to a variation in moisture content causes changes the geometrical and mechanical properties. Such are strongly affected by inter-fibre bonds, which responsible for transfer of hygro-mechanical response from one fibre its neighbours network, resulting sheet-scale deformation. Most models developed literature assume perfect bonding between fibres. 3D realit...

This paper describes recent efforts made by the Danish Building Research Institute regarding the integration of a life cycle assessment (LCA) method into a whole building hygro-thermal simulation tool. The motivation for the work is that the increased requirements to the energy performance of buildings (as expressed in EU Directive 2002/91/EC), may in the future be supplemented by requirements ...

This paper presents our effort to predict IC, packaging, and board level reliability problems. Micro-electronic based reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro-swelling, and/or the degradation of interfacial strength. In the past, such reliability problems were treated separately, but recent development have made ...

Following a recent world wide resurgence in the desire to build and operate nuclear power stations as a response to rising energy demands and global plans to reduce carbon emissions, and in the light of recent events such as those at the Fukushima Dai-ichi nuclear power plant in Japan, which have raised questions of safety, this work has investigated the long term behaviour of concrete nuclear ...