نتایج جستجو برای: heatsink

تعداد نتایج: 152  

2006
Simon Lineykin Sam Ben-Yaakov

This study proposes a user-friendly graphical method for calculating the steady-state operational point of a thermoelectric cooler (TEC)-based active cooling system, including the heatsink role. The method is simple and intuitive and provides comprehensive information about the cooling system such as its feasibility, required heatsink, the TEC current, temperatures of the cold and hot sides, an...

2000
S. G. Patterson E. K. Lau K. P. Pipe R. J. Ram

The temperature characteristics of bipolar cascade lasers operating up to 80 °C with room temperature, continuous-wave differential slope efficiencies of 93%, are reported. The continuous-wave characteristic lasing threshold temperature, T0 , of the device is found to be 103 K for heatsink temperatures below 40 °C, dropping to 56 K for heatsink temperatures in the range 50–80 °C. Two separate r...

The effect of utilizing superhydrophobic walls on improving the convective heat transfer in a rectangular heatsink has been studied numerically in this paper. The vertical walls were kept at isothermal hot-and-cold temperatures and horizontal walls were insulated. The boundary condition on the walls was: no-slip for regular, and slip (with slip length of 500 µm) for superhydrophobic walls. By c...

Journal: :Jurnal Nasional Komputasi dan Teknologi Informasi (JNKTI) 2019

Journal: :Industri Inovatif : Jurnal Teknik Industri 2020

Journal: :Journal of Fluid Flow, Heat and Mass Transfer 2015

Journal: :International Journal of Applied Power Engineering 2023

This research addresses the problem of temperature fluctuations affecting efficiency solar panels. A cooling system has been developed using a Peltier and combination air- water-cooling methods. The air-cooling involves placing coated with heatsink under panel, while uses pumped water on panel's surface. study aims to design panel reduce power losses compare its output standard includes Peltier...

Journal: :IEEE Transactions on Electromagnetic Compatibility 2002

2000
Howard Rajala Christie Ryan

Due to the emphasis on silicon junction temperatures in product testing, accura te velocities are typically not measured. Thus it is difficult to determine the flow boundary conditions for a numerical the rmal / f lu id analysis. Thermal conductivity values provided by vendors can also be in error. A calibration procedure using only simple temperature measu remen t s was developed to correlate ...

Journal: :IEEE Transactions on Components, Packaging and Manufacturing Technology 2019

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