In this work, a systematic study of the graphene/metal contact resistance (RC) is conducted. The circular Transfer Length Method (cTLM) is used to determine the RC values with several metals. Samples with Cu, Ti, Ni, Pt, Ag, Pd and Au contacts were fabricated and electrically characterized. Our results indicate that noble metals show lower RC. The lowest RC was observed for Au samples (~2.3kΩ.μ...

The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 020.4 at.% and annealed for 1 h at 500 and 600°C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different tem...

TiCx particle-reinforced Cu-matrix composites were prepared in the Cu-Ti-C system by thermal explosion and hot press. Extracted TiCx particles with various shapes of in situ TiCx particles in the Cu-Ti-C system were observed through the Field Emission Scanning Electron Microscope (FESEM). It was found that octahedral and close-to-spherical, spherical or cubic TiCx could be fabricated by changin...

The aim of this research is the thermostructural study of Cu-Ti, Cu-Ti 1 vol% multiwall carbon nanotubes (MWCNTs) and Cu-Ti 3 vol% MWCNTs. Several investigation techniques were used to achieve this objective. Dilatometric data show that the coefficient of thermal expansion of the nanocomposite containing less multiwall carbon nanotubes is linear and small. The same nanocomposite exhibits regula...

The 3D morphological evolution of titanium foams as they undergo a two-step fabrication process is quantitatively characterized through x-ray microand nano-tomography. In the first process step, a Cu–Ti–Cr–Zr prealloy is immersed in liquid Mg, where Cu is alloyed with Mg while a skeleton of crystalline Ti–Cr–Zr is created. In the second step, the Mg–Cu phase is etched in acid, leaving a Ti–Cr–Z...

A series ef binary Ti-Cu alloys containing 5-20 mass% Cu was prepared, and the corresien behavior of a-Ti and Ti2Cu composing the Ti-Cu alloys were examined based on the anodic polarization curves and released iens in O.9% NaCl and 1% lactic acid solutions. In both selutions, the Ti-Cu alloys showed the same anodic polarization curves as titanium in the conditien below 1.4 V. Hewever, precipita...

In this study, metallic elements that have limited/negligible solubility in pure magnesium (Mg) were incorporated in Mg using the disintegrated melt deposition technique. The metallic elements added include: (i) micron sized titanium (Ti) particulates with negligible solubility; (ii) nano sized copper (Cu) particulates with limited solubility; and (iii) the combination of micro-Ti and nano-Cu. ...

Cu/W composites are widely used in various industrial fields as they show thermomechanical properties suitable for a wide range of applications. Additionally, semiconductor products, WTi contact with Cu acts barrier material between and Si/SiO2. Therefore, the bonding behavior both Cu/WTi is great economical interest, also respect to effects that impurities could have on behaviour Cu/W(Ti) inte...

Excellent resistive switching memory characteristics were demonstrated for an Al/Cu/Ti/TaOx/W structure with a Ti nanolayer at the Cu/TaOx interface under low voltage operation of ± 1.5 V and a range of current compliances (CCs) from 0.1 to 500 μA. Oxygen accumulation at the Ti nanolayer and formation of a defective high-κ TaOx film were confirmed by high-resolution transmission electron micros...