This paper reports the correlation between film thickness, nanostructure and DC electrical properties of copper thin films deposited by PVD method on glass substrate. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used for crystallography and morphology investigation, respectively. Resistivity was measured by four point probe instrument, while a Hall effects measurement system w...

A high flux thin-film nanocomposite membrane epoxy/ zeolite NaA nanocomposite films prepared by using ultrasonic mixing and spin coating. The synthesized nanocomposites film was characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), thermal gravity analysis (TGA), and FTIR spectroscopy. Water softener and water flux characteristics of the epoxy/ zeolite NaA nanocomposite ...

A method to enhance surface plasmon coupled fluorescence (SPCF) from thin copper films using silver islands as an overlayer is presented. Silver islands were deposited onto copper thin films using a wet chemical technique for up to 60 s, which resulted in surface features ranging from randomly sized silver nanoparticles to a silver thin film. Theoretical Fresnel calculations predict the couplin...

Particle aggregation and film agglomeration have been among the main technical hurdles for solid-state thin film development and have been observed in many semiconductor and catalytic systems. In heterogeneous catalysis, particle aggregation leads to reduction of effective surface area and degradation of catalytic performance. On semiconductor surfaces, film agglomeration may give rise to elect...

Novel method doped carbon with nanoparticle Cr2O3 and thin film has been studied in much thought in wavelength range, the doping can help new excellent physical and chemical properties for carbon, this application has a semiconductor feature. Nanocomposite thin film deposited on copper and glass substrates have been created by utilizing Spray Pyrolysis method. The prec...

Interaction between 5 lm thick copper and 50 nm thin titanium films was investigated as a function of annealing temperature and time using MeV He Rutherford backscattering, X-ray diffraction and dynamic Secondary Ion Mass Spectrometry. Samples were made by depositing 10 nm of titanium on a PECVD silicon oxynitride, followed by 50 nm of titanium nitride and 50 nm of titanium in the said order. I...

Copper thin films with nano-scale structure have numerous applications in modern technology.  In this work, Cu thin films with different thicknesses from 50–220 nm have been deposited on glass substrate by DC magnetron sputtering technique at room temperature in pure Ar gas. The sputtering time was considered in 4, 8, 12 and 16 min, respectively. The thickness effect on the structural, mo...

Solar cells are becoming a highly promising alternative energy source for various markets. In the last five years or so a tremendous amount of research effort has been put into increasing the efficiency of solar cell technology and reducing its manufacturing cost. It is believed that success in both of these areas will further propel its use in various markets. The two major structures commerci...

This work reports the preparation of a three-dimensional Si thin film negative electrode employing a porous Cu current collector. A previously reported copper etching procedure was modified to develop the porous structures inside a 9 μm thick copper foil. Magnetron sputtering was used for the deposition of an n-type doped 400 nm thick amorphous Si thin film. Electrochemical cycling of the prepa...

We evaporated polycrystalline copper thin films of thickness between 10 and 100nm on silicon substrates with their native oxide under ultra-high-vacuum conditions. Some of them were exposed to air for a period ranging from 1 day to 2 weeks. X-ray photoelectron spectroscopy (XPS) revealed a clean copper surface with a trace of oxygen. These films that were exposed to air presented oxides in the ...