نتایج جستجو برای: abrasive particles

تعداد نتایج: 159498  

2013
Florence PASCARETTI-GRIZON Guillaume MABILLEAU Daniel CHAPPARD

OBJECTIVES The abrasion of dentifrices is well recognized to eliminate the dental plaque. The aims of this study were to characterize the abrasive powders of 6 dentifrices (3 toothpastes and 3 toothpowders) and to measure the abrasion on a test surface by Vertical Scanning Interference microscopy (VSI). MATERIAL AND METHODS Bright field and polarization microscopy were used to identify the ab...

2012

Adhesion strength of exterior or interior coating of steel pipes is too important. Increasing of coating adhesion on surfaces can increase the life time of coating, safety factor of transmitting line pipe and decreasing the rate of corrosion and costs. Preparation of steel pipe surfaces before doing the coating process is done by shot and grit blasting. This is a mechanical way to do it. Some e...

2007
Elon J. Terrell C. Fred Higgs

Chemical mechanical polishing (CMP) is a manufacturing process in which a wafer surface is polished by pressing it against a rotating pad that is flooded with slurry. The slurry itself is a fluid containing abrasive particles. Past experimentation has shown that the distribution of suspended particles in the slurry is significantly related to the distribution of material removal on the wafer du...

2018
Junye Li Wenqing Meng Kun Dong Xinming Zhang Weihong Zhao

Abrasive flow polishing plays an important part in modern ultra-precision machining. Ultrafine particles suspended in the medium of abrasive flow removes the material in nanoscale. In this paper, three-dimensional molecular dynamics (MD) simulations are performed to investigate the effect of impacting direction on abrasive cutting process during abrasive flow polishing. The molecular dynamics s...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه مراغه - دانشکده فنی 1392

فولاد گرم کار aisi h13 بطور وسیع در صنایع قالبسازی مورد استفاده قرار می گیرد. با توجه به گسترش روز افزون تکنولوژی و نیاز به ساخت قالبهایی با پرداخت سطح بهتر و با توجه به عدم توانایی فرآیندهای سنتی در دستیابی به چنین پرداختهای سطحی بخصوص در مورد قطعاتی با ابعاد و اشکال پیچیده رویکرد مراکز تحقیقاتی به سمت فرآیندهای نوین می باشد. از جمله این فرآیندهای جدید که در طی سالیان اخیر مورد توجه قرار گرفته...

2018
Beata Śmielak Leszek Klimek

Background: Determination of the number of abrasive particles embedded in the zirconia surface after variable parameters of treatment. METHODS One hundred thirty cylindrical disks made from zirconia were divided into 7 groups (n = 10): one control and six test groups treated by air abrasion using Al₂O₃ or SiC with grain sizes: 60, 110, 250 μm with a working pressure of 0.2 or 0.35 MPa. The SE...

2002
F. E. TALKE

An experimental investigation into material transfer and wear has been performed for the case of a ferrite probe sliding at high speeds (between 25 cm/set and 1250 cm/set) and low loads (10 gm) on a steel disk, a nickel plated disk, and a polymercoated disk, the latter containing finely dispersed abrasive particles. Autoradiographic methods together with microdensitometer analysis have been app...

2012
Libor Sitek Josef Foldyna Petr Martinec Jiří Klich Miroslav Mašláň

Original scientific paper High-velocity water jet expanded into many fields of human activity due to its unique properties. Besides already traditional technological processes it begins to find its way also to the comminution of mineral particles. The paper analyzes the possibility of particle comminution using an abrasive mixing head used to generate high-velocity abrasive water jet and an imp...

Journal: :JCP 2012
Yunwei Zhao Dexu Geng Xiaomin Liu

The surface roughness and material removal is investigated in electrorheological (ER) fluid-assisted polishing of tungsten carbide die. In this study, the microstructure of fibrous columns formed by particles perpendicular to the electrodes is observed by CCD when the electrical field is applied. The distribution of the electric field strength on the surface of workpiece was analyzed by ANSYS a...

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