Both a Cu-26 wt % Ag (Fe-free) alloy and Cu-26 wt % Ag-0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the siz...

Reliability of QFP (quad flat package) solder joints after thermal shock was investigated for PCB’s and connecting leads plated with several different alloy coatings before soldering. Sn–8 wt%Zn–3 wt%Bi (hereafter, Sn–8Zn–3Bi) was selected as a solder, and FR-4 PCB’s finished with Cu/Sn, Cu/OSP and Cu/Ni/Au were used as substrates. The leads of the QFP were Cu plated with Sn–10 wt%Pb, or Sn, or...

Single pan thermal analyses (SPTA) have been performed on Cu–14.5 wt.% Sn, Cu–21.3 wt.% Sn and Cu–26.8 wt.% Sn peritectic alloys. For this purpose, a SPTA assembly has been built and calibrated. As the latent heat is a function of temperature and composition during solidification of alloys, a new heat flow model coupled to a Cu–Sn thermodynamic database has been defined for the calculation of t...

A simple, inexpensive, and novel method was used to prepare electrocatalysts from Cu supported on titanium dioxide (Cu/TiO2). XRD, SEM, and TEM characterizations confirmed different loadings of Cu nanoparticles (NPs) on TiO2. Cyclic voltammetry tests indicated that Cu/TiO2 exhibited lower overpotential for CO2 reduction than that of Cu NPs. Moreover, 40 wt % Cu/TiO2 exhibited the highest farada...

The influence of Ta additions on the microstructure and properties of Cu-Al-Ni shape memory alloys was investigated in this paper. The addition of Ta significantly affects the green and porosity densities; the minimum percentage of porosity was observed with the modified prealloyed Cu-Al-Ni-2.0 wt.% Ta. The phase transformation temperatures were shifted towards the highest values after Ta was a...