نتایج جستجو برای: void of flow

تعداد نتایج: 21214507  

Journal: :TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 2008

Journal: :تحقیقات آب و خاک ایران 0
بیژن پارسائی علی رئیسی استبرق مجید مرادی

expansive soils show swelling and shrinkage behavior when subjected to cyclic wetting and drying. the variation in water content influence the volume change in this kind of soil. these volume changes can cause ground movement which may result in damage to the buildings and structures. to study the behavior, a number of successive wetting-drying cycles were conducted on a statically compacted ex...

Journal: :journal of dental materials and techniques 0
maryam ehsani dental material research center, department of endodontics, dental faculty, babol university of medical sciences, babol, iranسازمان اصلی تایید شده: دانشگاه علوم پزشکی بابل (babol university of medical sciences) farida abesi dental material research center, department of oral & maxillofacial radiology, dental faculty, babol university of medical sciences, babol, iranسازمان اصلی تایید شده: دانشگاه علوم پزشکی بابل (babol university of medical sciences) tania ghasemi student research committee of babol university, dental faculty, babol university of medical sciences, babol, iranسازمان اصلی تایید شده: دانشگاه علوم پزشکی بابل (babol university of medical sciences)

introduction: there is substantial evidence that the technical quality of root canalfilling has a significant effect on the outcome of root canal treatment. theaim of this study was to evaluate the technical quality of root canal fillingsperformed by dental students. methods: the records of 325 teethradiographs, treated by dental students in 2008-2009 in babol dental school,were selected and ev...

Journal: :Microelectronics Reliability 2012
Kenny C. Otiaba R. S. Bhatti Ndy N. Ekere Sabuj Mallik M. O. Alam Emeka H. Amalu Mathias Ekpu

Chip scale package (CSP) technology offers promising solutions to package power device due to its relatively good thermal performance among other factors. Solder thermal interface materials (STIMs) are often employed at the die bond layer of a chip-scale packaged power device to enhance heat transfer from the chip to the heat spreader. Nonetheless, the presence of voids in the solder die-attach...

Journal: :Environmental science and pollution research international 2015
Shi-Jin Feng Ben-Yi Cao Xu Zhang Hai-Jian Xie

Leachate recirculation (LR) in municipal solid waste (MSW) landfills operated as bioreactors offers significant economic and environmental benefits. The subsurface application method of vertical wells is one of the most common LR techniques. The objective of this study was to develop a novel two-dimensional model of leachate recirculation using vertical wells. This novel method can describe lea...

Journal: :TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 2013

Journal: :TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 2000

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