نتایج جستجو برای: total etch
تعداد نتایج: 803502 فیلتر نتایج به سال:
Dentin bonding agents create stronger bonding between dental composites and dentin. But, none of them can prevent the microleakage. The important factors of progressing microleakage are the stress of polymerization shrinkage of resin composite and removal of smear layer in total-etch technique. The aim of this study was the evaluation of the effect of experimental method (modifying smear layer ...
Background: Restoring bonding composite to silver diamine fluoride (SDF)-treated enamel is challenging. This study investigates if phosphoric acid etch restores bond strength SDF-treated using universal adhesives. Methods: Twenty-four recently extracted permanent teeth were randomly divided into 4 (2 experimental (SDF) and 2 control (CTR)) groups: SDF+Water: SDF (1 min) then water rinse (15 mL)...
The dc current gain dependence of InGaP/GaAs heterojunction bipolar transistors (HBTs) on subcollector and etch-stop doping is examined. Samples of InGaP/GaAs HBTs having various combinations of subcollector doping and etch-stop doping are grown, and large area (60 m 60 ( ) HBTs are then fabricated for dc characterization. It is found that the dc current gain has a strong dependence on the dopi...
The magnetic tunnel junction (MTJ)-related materials such as CoFeB, CoPt, MgO, and Ru, and W were etched using CH3OH in a pulse-biased inductively coupled plasma system and the effect of bias pulsing (100% 30% duty percentage) on the etch characteristics of the MTJ-related materials was investigated at the substrate temperature of 200 degrees C. The etch selectivity of MTJ-related materials ove...
Electrical through-wafer interconnects (ETWI) are often integrated with inertial sensors for harsh liquid environment applications. Devices with metal interconnects are very susceptible to corrosion in aquatic environments. An alternative approach is to form highly doped, conductive polysilicon through the wafer from the back side (unexposed to harsh environments) to the front side of the devic...
Abstract: In this paper, a DRIE process for fabricating MEMS silicon trenches with a depth of more than 250 m is described. The DRIE was produced in oxygen-added sulfur hexafluoride (SF6) plasma, with sample cooling to cryogenic temperature using a Plasmalab System 100 ICP 180 at different RF powers. A series of experiments were performed to determine the etch rate and selectivity of the some m...
microleakage can be responsible for tooth hypersensitivity, secondary caries, and the possibility of pathological pulp alterations in restored teeth. recently, alternative methods for tooth preparation such as laser irradiation have been studied; but there are limited studies on primary teeth. the aim of this in vitro study was to compare the degree of microleakage of composite restorations pre...
The latest adhesive systems require fewer and simpler application steps and have shorter application times in clinical settings1), leading to time-saving options such as single-step self-etch adhesives2). Recent trend in adhesive systems is the use of the so-called universal adhesive which can be used with total-etch, self-etch, or selective-etch techniques3), and can also be used to bond to a ...
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