This paper developed an active scanning probe array. The probe array consists of 16×2 probes thermally actuating and sensing. The 32 probes are integrated with Ti/Pt temperature sensors and bimorph thermal actuators. Each probe is a Si3N4 cantilever equipped with a sharp nano scale pyramid tip at its free end. When one of the probes is actuated, its neighboring probes can provide temperature se...

Theoretical and experimental investigations have been carried out to examine the in uence of laser power and on time on the weld thermal cycle and weld metal microstructure and hardness during laser spot welding of low alloy steel. A transient heat transfer model that takes into account the temperature dependence of material properties and latent heat of phase transformation is employed to sim...

Plastic-ball-grid-array (PBGA) packages were assembled onto FR-4 printed-circuit-boards (PCBs) using lead-free SnAgCu solder, different solder pad diameters, stencil thicknesses and reflow peak temperatures, and the effects of the design and assembly process conditions on the dimensions and reliability of the solder joints were investigated. The assembled microelectronic devices were subjected ...

233 All material systems are dynamic. From subatomic particles, through atoms, to molecules and biochemicals, processes express and create complex patterns of vibrations (cycles) over time. Living systems, as conventionally defined by biology, express complex dynamic patterns of vibration over large ranges of frequencies. The human body emits dynamic patterns of thermal radiation as well as ele...

Thermal stress including temperature gradients in time and space, as well as thermal cycling, influences lifetime reliability and performance of modern Multiprocessor Systemson-Chip (MPSoCs). Conventional power and temperature management techniques considering the peak temperature/power consumption do not provide a comprehensive solution to avoid high spatial and temporal thermal variations. Th...

Several studies have reported the benefits of sonic and/or ultrasonic instrumentation for root debridement, with most of them focusing on changes in periodontal clinical parameters. The present study investigated possible alterations in the tensile bond strength of crowns cemented with zinc phosphate cement to natural teeth after ultrasonic instrumentation. Forty recently extracted intact human...

In this paper an e cient sequential approach for simulating thermal stresses in brake discs for repeated braking is presented. First a frictional heat analysis is performed by using an Eulerian formulation of the disc. Then, by using the temperature history from the rst step of the sequence, a plasticity analysis with temperature dependent material data is performed in order to determine the co...

Solder joint reliability of SMT components connected to printed circuit boards is well documented. However, much of the testing and data is related to high-strain energy thermal cycling experiments relevant to product qualification testing (i.e., -55C to 125C). Relatively little information is available on low-strain, high-cycle fatigue behavior of solder joints, even though this is increasingl...

This study describes a micro device integrated with multi-chamber for polymerase chain reaction (PCR) with different annealing temperatures. The device consists of the reaction polydimethylsiloxane (PDMS) chip, a cover glass chip, and is equipped with cartridge heaters, fans, and thermocouples for temperature control. In this prototype, commercial software is utilized to determine the geometric...

Purpose: The purpose of this study was to determine the influence of silicone remover on tensile bond strength of eight silicone-resilient denture liners to a denture base resin. Durability of bond strength of resilient denture liner to denture base resin was also examined by thermal cycling test. Materials and Methods: Eight commercial silicone resilient denture liners were used. The specimens...