There are three areas to consider when designing/implementing wire bonding to advanced ULSI damascene–copper chips having copper metallization and low dielectric-constant polymers embedded beneath them (Cu/LoK). These are: 1) the copper-pad top-surface oxidation inhibitor coatingmetal/organic/inorganic. (Current work involves evaluating the metal and inorganic options); 2) the low dielectric co...

Background and Aim: Microleakage is a drawback of composite restorations and it is more noticeable in dentinal walls. Despite advances in dentin bonding agents, no adhesive can completely eliminate microleakage and provide a hermetic seal. This study aimed to compare microleakage of three resin bonding agents namely a universal adhesive, two-step self-etch system and two-step total-etch system....

Conductive asphalt concrete with high thermal conductivity has been proposed to improve the solar energy collection and snow melting efficiencies of asphalt solar collector (ASC). This paper aims to provide some insight into choosing the basic materials for preparation of conductive asphalt concrete, as well as determining the evolution of thermal characteristics affected by environmental facto...

The thermal insulation properties of barrier coatings (TBCs) can be significantly improved with increasing the coating thickness. However, due to weak bonding high-thickness TBCs, low reliability and short lifetime greatly limits their application under some severe operating conditions. In this study, a novel high-efficiency synchronous dual powder feeding method is used deposit series gradient...

Flow sensing in hostile environments is of increasing interest for applications in the automotive, aerospace, and chemical and resource industries. There are thermal and non-thermal approaches for high-temperature flow measurement. Compared to their non-thermal counterparts, thermal flow sensors have recently attracted a great deal of interest due to the ease of fabrication, lack of moving part...

Utilizing the intramolecular CH–N hydrogen bonding and bulky substituents at reactive carbons resulted in development of photochromic diarylbenzene with both high photoreactivity fast thermal back reactivity.