نتایج جستجو برای: stress rupture creep

تعداد نتایج: 485696  

2000
B. Q. Han

Creep experiments were performed on dispersion-strengthened-cast magnesium (DSC-Mg), consisting of unalloyed magnesium with 1 mm grain size containing 30 vol.% of 0.33 mm yttria particles. Strain rates were measured for temperatures between 573 and 723 K at compressive stresses between 7 and 125 MPa. DSC-Mg exhibits outstanding creep strength as compared with other magnesium materials, but is l...

2013
Zongying Fu Yingchun Cai Jingyao Zhao Siqi Huan

The process of wood drying can induce defects caused by drying stress, which limits the processing and utilization of this valuable material. Here, we investigated elastic strain, viscoelastic creep strain, and mechanosorptive (MS) creep strain caused by shrinkage anisotropy using the image analytical method during slow conventional drying of white birch (Betula platyphylla Suk) disks. The rheo...

2016
Josip Brnic Goran Turkalj Marko Canadija Domagoj Lanc Sanjin Krscanski Marino Brcic Qiang Li Jitai Niu

The correct choice of a material in the process of structural design is the most important task. This study deals with determining and analyzing the mechanical properties of the material, and the material resistance to short-time creep and fatigue. The material under consideration in this investigation is austenitic stainless steel X6CrNiTi18-10. The results presenting ultimate tensile strength...

2014
Xiaojun Yang Meng Gong Ying Hei Chui

Carbon fiber reinforced plastic (CFRP) was used to adhesively reinforce Chinese fir (Cunninghamia lanceolata) wood specimens. This study examined the flexural static and creep performances of CFPR-reinforced wood composites that had been subjected to changes in moisture and stress levels. The major findings were as follows: 1) the cyclic creep was slightly lower for those specimens subjected to...

Journal: :Materials transactions 2023

The macroscopic creep properties of negative electrodes in lithium-ion batteries and their estimation methods have been investigated based on the microscopic structure electrode. Tensile tests were conducted a electrode consisting carbon powder polyvinylidene fluoride (PVDF) binder. stress-strain curve, time history tensile strain, rupture measured these estimated using simple model proposed th...

2011
Cristiano Collettini André Niemeijer Cecilia Viti Steven A.F. Smith Chris Marone

a r t i c l e i n f o Recent high-resolution GPS and seismological data reveal that tectonic faults exhibit complex, multi-mode slip behavior including earthquakes, creep events, slow and silent earthquakes, low-frequency events and earthquake afterslip. The physical processes responsible for this range of behavior and the mechanisms that dictate fault slip rate or rupture propagation velocity ...

Journal: :Physical review letters 2010
Mukul Kabir Timothy T Lau David Rodney Sidney Yip Krystyn J Van Vliet

Here we report kinetic Monte Carlo simulations of dislocation climb in heavily deformed, body-centered cubic iron comprising a supersaturation of vacancies. This approach explicitly incorporates the effect of nonlinear vacancy-dislocation interaction on vacancy migration barriers as determined from atomistic calculations, and enables observations of diffusivity and climb over time scales and te...

2010
Yoichi Ishida

steady state creep of the alloy was in a thermodynamical steady state, (2) which configuration of the dislocation network was contributing to the creep strength, and (3) which change in the dislocation network was the cause of the creep recovery. Specimens were furnace-cooled under stress and then observed by transmission electron microscopy. The creep stress was reduced during the test and the...

2007
Emily E. Brodsky James Mori

[1] We find that slow seismic events have smaller fault slips compared to ordinary earthquakes with similar dimensions. For ordinary earthquakes, the ratio of slip to fault length is largely consistent, yet the physical controls on this ratio are unknown. Recently discovered slow slip or creep events in which faults move quasi-statically over periods of days to years shed new light on this old ...

2014
KANG JUNG HO-KYUNG KIM

A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with sub-μm-scale accuracy, and a load-cell with mN-scale accuracy of in an effort to investigate the creep behavior of a small solder ball with a diameter of less than 1 mm. The creep behavior of a lead-free solder ball (Sn-3.0Ag-0.5Cu) with a diameter of 760 μm was inve...

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