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This paper describes a biomimetic strategy for the fabrication of 3D structures-including an electrically functional light detector-modeled on the folding of biological macromolecules into globular shapes. The process started by fabricating precursors to 3D, millimeter-sized structures using flexible polymer tapes. These tapes were patterned with metal features supporting liquid solder, crimped...

A model for the theoretical description of KIRKENDALL voiding is presented based on vacancy diffusion and plastic deformation of spherical voids. We start with a phenomenological explanation of the KIRKENDALL phenomenon and discuss its consequences on microelectronic reliability. After that a constitutive model for void growth is introduced, which, for instances, can be used in order to predict...

A new re¯ow parameter, heating factor (Q g), which is de®ned as the integral of the measured temperature over the dwell time above liquidus, has been proposed in this report. It can suitably represent the combined e€ect of both temperature and time in usual re¯ow process. Relationship between reliability of the micro-ball grid array (micro-BGA) package and heating factor has been discussed. The...

The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details systematic study the effect annealing process on microstructure and shear strength Zn-added Sn-0.7Cu joint. results indicated that IMC layer’s thickness at solder/Cu interface increases with time. interfacial layer gradually thickened increasing time temperature, while mor...

Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill encapsulant is an attractive flip-chip encapsulant due to the simplification of the no-flow underfilling process. To develop the no-flow underfill material suitable for the no-flow underfilling process of flip-chip solder joint interconnects, we have studied and developed a ...

Abstract An influence of carbon nanotubes and nanospheres coated by Au–Pd Pt on the microstructure solder/copper joints at room temperature after aging sub-zero temperature. The nanosized admixtures were mixed with ternary Sn3.0Ag0.5Cu matrix to prepare a composite solder. solder between nanocomposite solders copper substrate was studied scanning electron microscopy. It found that minor (0.05 w...