The aim of this study was to evaluate the fracture load and failure mode of all-ceramic crowns with different ceria-stabilized tetragonal zirconia/alumina nanocomposite (Ce-TZP/A) framework designs. Four frameworks (anatomical shape: AS, with a buccal or lingual supporting structure: BS and LS, or buccal and lingual supporting structures: BLS) were fabricated. All frameworks were veneered with ...

A systematic study of interfacial fracture energies of thin gold films as a function of film thickness is presented in this paper. The films were sputter deposited onto sapphire substrates to thicknesses ranging from 10 nm to 200 nm. Nanoindentation was used to measure mechanical properties and combined with stressed overlayers to trigger delamination and buckling. Fracture energies and interfa...

We present a novel approach to analyse the fracture of fibre-reinforced composites. Experimental results on mode I fracture of glass fibre and carbon fibre unidirectional laminates presented here and published by others in the open literature formed the basis for the analytical and numerical results presented. When details of the external loading rate are explicitly accounted for, a new picture...

Cracking of rocks and rock-like materials exhibits a rich variety patterns where tensile (mode I) shear II) fractures are often interwoven. These mixed-mode usually cohesive (quasi-brittle) frictional. Although phase-field modeling is increasingly used for rock fracture simulation, no formulation available frictional fracture. To address this shortfall, here we develop double-phase-field that e...

Effects of different amounts of lead (Pb) and tin (Sn) on microstructure and tensile properties of the AZ91 alloy were studied. The results presented that the microstructure of AZ91 alloy is consisted the α-Mg phase and semi-continuous network of β-Mg17Al12 intermetallics. For the as-cast AZ91 alloy, the average grain siz and the β phase volume fraction were 96.2 µm and of 25.3%, respectively. ...

The demands by the semiconductors industry for high levels of integration, lower costs and a growing need for complete system solutions has led to the emergence of ”System In Package” (SIP) solutions in which ”the package is the system”. Since SIP-microsystems have multiple thin and stacked layers manufactured using different processes and materials, internal (intrinsic and/or thermal) mismatch...