In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability bumps, which plays role in mechanical support, electrical connection, signal transmission heat dissipation, determines quality packaging. Surface morphological defects are one main factors affecting closely related to materials bonding process parameters. th...

The present study evaluates the effect of a substrate’s silicon content on coatings’ morphology, structure, and properties in an electrolyte containing sodium tungstate Al–xSi alloys. PEO-coated samples demonstrated structure pancake crater with irregular micro-cracks micro-pores. incorporation element W coatings decreased surface roughness porosity due to increasing conductivity and, hence, de...

Motility of nerve growth cones (GCs) is regulated by region-specific activities of cell adhesion molecules (CAMs). CAM activities could be modified by their localization to detergent-resistant membranes (DRMs), specialized microdomains enriched in signaling molecules. This paper deals with a question of whether DRMs are involved in GC migration stimulated by three CAMs; L1, N-cadherin (Ncad), a...

Ni alloys have managed to cover wide range of applications such as automotive industries, oil gas industries, and aerospace industries. However, these alloys impose challenges while using conventional machining technologies. On the other hand, Micro-Electro-Discharge machining (micro-EDM) is a nonconventional machining method that uses controlled sparks energy to remove material irrespective of...

In order to understand and to simulate the functional behaviour of porous structures during loading, quantitative knowledge of the relationship between the morphology and the mechanical behaviour is necessary. Therefore, the porous structures need to be quantified morphologically. In this research, the quantification will be performed by using micro-CT. However, to date, this technique encounte...