This article summarizes the most recent technological developments in the realization of integrated aluminum nitride (AlN) piezoelectric microelectromechanical system (MEMS) for radio frequency (rf) front ends to be employed in next generation wireless communication devices. The AlN-based resonator and switch technologies are presented, their principle of operation explained, and some key exper...

The convergence of Micro Electro Mechanical Systems (MEMS) and optics was, at the end of the last century, a fertile ground for a new breed of technological and scientific achievements. The weightlessness of light has been identified very early as a key advantage for micro-actuator application, giving rise to optical free-space MEMS devices. In parallel to these developments, the past 20 years ...

By controlling the degrees of freedom for the components in the system and using a PWL solver, a tradeoff between speed and accuracy is realized. Electrical components are modeled using a similar MNA technique. The interaction between electrical and mechanical components is accomplished by modeling the coupled energy between the domains. In this paper we demonstrate the capabilities of our syst...

By controlling the degrees of freedom for the components in the system and using a PWL solver, a tradeoff between speed and accuracy is realized. Electrical components are modeled using a similar MNA technique. The interaction between electrical and mechanical components is accomplished by modeling the coupled energy between the domains. In this paper we demonstrate the capabilities of our syst...

Two stacked integration methods have been developed to enable advanced microsystems of microelectromechanical systems (MEMS) on large scale integration (LSI). One is a wafer level transfer of MEMS fabricated on a carrier wafer to a LSI wafer. The other is the use of electrical interconnections using through-Si vias from the structure of a MEMS wafer on a LSI wafer. The wafer level transfer meth...