نتایج جستجو برای: interfacial area

تعداد نتایج: 604570  

2018
Zhi-xin Yang Jun-yi Sun Ke Li Yong-sheng Lian Xiao-ting He

In this study, based on the pressure blister test technique, a theoretical study on the synchronous characterization of surface and interfacial mechanical properties of thin-film/substrate systems with residual stress was presented, where the problem of axisymmetric deformation of a blistering film with initial stress was analytically solved and its closed-form solution was presented. The expre...

The present contribution deals with the numerical modeling of railway track-supporting systems-using coupled finite-infinite elements-to represent the near and distant field stress distribution, and also employing a thin layer interface element to account for the interfacial behavior between sleepers and ballast. To simulate the relative debonding, slipping and crushing at the contact area betw...

Journal: :Dental materials journal 1995
K Wakasa M Yamaki A Matsui

Average stress during shear bond testing, and deformation behaviour during nano-indentation testing were calculated for the bonding area as a bonding site for copolymerization with resin composite in dentine bonding systems. First average stress was calculated in the bonding area between bovine dentine and composite resin. Secondly, the plastic deformation zone size was calculated using an elas...

Journal: :DEStech Transactions on Engineering and Technology Research 2017

2009
Minshu Zhang S. W. Ricky Lee Xuejun Fan

Interfacial delamination is the major reliability issue of Quad Flat No-lead (QFN) packages under the JEDEC-MSL preconditioning and reflow process. Failures will occur when the hygrothermal stress exceeds the interfacial strength. Simulation based on finite element model is a popular method for studying the failure mechanism. However, the non-accurate material properties and lack of experiment ...

Journal: :Journal of vacuum science & technology 2023

Area-selective atomic layer deposition (AS-ALD) is a coveted method for the fabrication of next-generation nano-electronic devices, as it can complement lithography and improve alignment through scale control. Selective reactions small molecule inhibitors (SMIs) be used to deactivate growth on specific surface areas such enable AS-ALD. To investigate new applications ASD, we need insight into S...

2010
N. Wang O. I. Lobkis S. I. Rokhlin J. H. Cantrell

The inverse determination of imperfect interfaces from reflection spectra of normal and oblique incident ultrasonic waves in adhesive bonds of multidirectional composites is investigated. The oblique measurements are complicated by the highly dispersed nature of oblique wave spectra at frequencies above 3MHz. Different strategies for bond property reconstruction, including a modulation method, ...

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