In most cases authors are permitted to post their version of the article (e.g. in Word or Tex form) to their personal website or institutional repository. Authors requiring further information regarding Elsevier's archiving and manuscript policies are encouraged to visit: a b s t r a c t The reactions between Sn2.5Ag solder doped with different levels of Ni (0–0.1 wt.%) and two different types ...

Copper (Cu) is an essential metal that is toxic at high concentrations. Thus, pathogens often rely on host Cu for growth, but host cells can hyperaccumulate Cu to exert antimicrobial effects. The human fungal pathogen Cryptococcus neoformans encodes many Cu-responsive genes, but their role in infection is unclear. We determined that pulmonary C. neoformans infection results in Cu-specific induc...

Cu(0) nanoparticles were deposited on a nanoporous polymer to develop a novel nanocatalyst (Cu-B) for carrying out Ullmann coupling of aryl halides with amines in water. Non-aqueous polymerization of a mixture of divinylbenzene and acrylic acid under hydrothermal conditions followed by the deposition of Cu(0) nanoparticles were adopted to afford the Cu-B nanocatalyst. In order to compare the ca...

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...

Copper (Cu) could be suitable to create anti-infective implants based on Titanium (Ti), for example by incorporating Cu into the implant surface using plasma immersion ion implantation (Cu-PIII). The cytotoxicity of Cu might be circumvented by an additional cell-adhesive plasma polymerized allylamine film (PPAAm). Thus, this study aimed to examine in vivo local inflammatory reactions for Ti6Al4...

The interaction of ultrathin fdms of Cu with Rh(100) and Ru(0001) has been examined by using X-ray photoelectron spectrapcopy (XPS). The effects of surface annealing temperature, adsorbate coverage (film thickness), and CO chemisorption were investigated. The XPS data show that the atoms in a monolayer of Cu supported on Rh( 100) or Ru(0001) are electronically perturbed with respect to the surf...

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10μm and 15μm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a m...

The reduction of Cu(II) oxide species in siliceous matrixes of different porosity (MFI, FAU, MCM-48) and in alumosilicate MFI was studied by temperature-programmed reduction in hydrogen (TPR), by X-ray absorption fine structure (after stationary hydrogen treatments), and by transmission electron microscopy. It was found that the reduction may proceed in one or in two reduction steps. The two-st...

64Cu accumulation and total Cu concentrations were measured in gill filaments, plasma, liver and bile of fed and starved European eels (Anguilla anguilla) during 28 days of exposure to 12 and 94 micrograms Cu l-1. Branchial Cu uptake was found to be 0.03 and 0.13 microgram Cu g gill filament-1 h-1 at 12 and 94 micrograms Cu l-1, respectively, throughout 28 days of Cu exposure. At least during e...

Plastocyanin, which requires copper (Cu) as a cofactor, is an electron carrier in the thylakoid lumen and essential for photoautotrophic growth of plants. The Cu microRNAs, which are expressed during Cu deprivation, down-regulate several transcripts that encode for Cu proteins. Since plastocyanin is not targeted by the Cu microRNAs, a cofactor economy model has been proposed in which plants pri...