نتایج جستجو برای: a portion via cuticle and others via stomata
تعداد نتایج: 20426553 فیلتر نتایج به سال:
The direct write technology provides an interesting opportunity for plugging blind via holes as a more precise alternative to currently used screen printing processes. This technology provides a complete, void-less filling of the via and fabrication of the interconnects extending from the via in one single step. After deposition, the material is heat treated (sintered) to densify into a highly ...
We studied electromigration (EM) lifetimes and void growth at low cumulative failure probability. We carried out EM test in damascene Cu lines using sudden-death type test structures. Its cumulative failure probability ranges from 0.005 to 90%. To investigate the void growth behaviour, Cu microstructures was investigated. EM lifetime shows correlation with the void nucleation site and the void ...
Variable Impedance Actuators (VIA) have received increasing attention in recent years as many novel applications involving interactions with an unknown and dynamic environment including humans require actuators with dynamics that are not well-achieved by classical stiff actuators. This paper presents an overview of the different VIAs developed and proposes a classification based on the principl...
While there are a multitude of programming and development standards in place for designing and building government software systems, there are few specific guidelines and special processes in place designed to assure the security and integrity of DOD weapons platforms. Such platforms include C2 (Command and Control) and C3 (Computers, Command, and Control) systems. Guidelines such as AR 380-19...
| Constrained Via Minimization is the problem of reassigning wire segments of a VLSI routing so that the number of vias is minimized. In this paper, a new approach is proposed for twolayer VLSI routing. This approach is able to handle any types of routing, and allows arbitrary number of wire segments split at a via candidate.
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.021 ⇑ Corresponding author at: STMicroelectronics, 8 Crolles, France. Tel.: +33 4 38 92 27 30. E-mail address: [email protected] (T. Frank). In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu TSV-la...
We consider a game where one player, the Announcer, has to communicate the value of a payoff relevant state of the world to a set of players who play a coordination game with multiple equilibria. While the Announcer and the players agree that coordination is desirable, since the payoffs of the players at the equilibria are unequal, they disagree as to which equilibrium is best. We demonstrate e...
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