نتایج جستجو برای: 3d wound core

تعداد نتایج: 468205  

2014
T. Oikawa T. Tajima K. Masumoto H. Kawaguchi H. Kometani Tomoaki Oikawa Tsuneyoshi Tajima Koji Masumoto Hiroyuki Akita Hitoshi Kawaguchi Haruyuki Kometani

To promote energy saving, we developed a high efficiency brushless DC motor with a new manufacturing method of a stator for compressors. This motor consists of a concentrated winding stator and an interior permanent magnet rotor. The stator has the core structure that we call “a joint-lapped core”. The joint-lapped core is able to open and bend in reverse. While winding the coil, the joint-lapp...

2016
Benjamin K Robinson Ernesto Cortes Alistair J Rice Muge Sarper Armando Del Río Hernández

Extracellular matrix (ECM) remodelling is integral to numerous physiological and pathological processes in biology, such as embryogenesis, wound healing, fibrosis and cancer. Until recently, most cellular studies have been conducted on 2D environments where mechanical cues significantly differ from physiologically relevant 3D environments, impacting cellular behaviour and masking the interpreta...

2013
Christiane Goepfert Grit Blume Rebecca Faschian Stefanie Meyer Cedric Schirmer Wiebke Müller-Wichards Jörg Müller Janine Fischer Frank Feyerabend Ralf Pörtner

Background Advanced cell culture models, especially long-term 3D systems, require bioreactors allowing for cultivation under continuous flow conditions. Such culture models are for example tissue engineered implants, 3D cultures for drug testing, in vitro models of cell growth and migration for wound healing studies, cell cultures for biomaterial testing. New challenges in drug testing and biom...

2015
Dustin G. Thomas Aishwarya Yenepalli Celine Marie Denais Andrew Rape Jordan R. Beach Yu-li Wang William P. Schiemann Harihara Baskaran Jan Lammerding Thomas T. Egelhoff

Non-muscle myosin II (NMII) is reported to play multiple roles during cell migration and invasion. However, the exact biophysical roles of different NMII isoforms during these processes remain poorly understood. We analyzed the contributions of NMIIA and NMIIB in three-dimensional (3D) migration and in generating the forces required for efficient invasion by mammary gland carcinoma cells. Using...

2011
Kenichiro Kawai Barrett J. Larson Hisako Ishise Antoine Lyonel Carre Soh Nishimoto Michael Longaker H. Peter Lorenz

INTRODUCTION Nanoparticles (NPs) are small entities that consist of a hydroxyapatite core, which can bind ions, proteins, and other organic molecules from the surrounding environment. These small conglomerations can influence environmental calcium levels and have the potential to modulate calcium homeostasis in vivo. Nanoparticles have been associated with various calcium-mediated disease proce...

Journal: :J. Electronic Testing 2013
Ismail Akturk Ozcan Ozturk

Ability to stack separate chips in a single package enables threedimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit area. An important issue in designing a heterogeneous 3D IC is reliability. To achieve this, one needs to select the data mapping and processor layout carefully. This paper addr...

2014
Sho Fujisawa Dmitry Yarilin Ning Fan Mesruh Turkekul Ke Xu Afsar Barlas Katia Manova-Todorova

In many fields of biological sciences including embryology and cancer research, understanding of 3-dimensional structures is crucial to uncovering normal and pathological phenomena. While the most optimal method would be to directly observe the complete object without any destruction, staining and imaging of thick sections and whole mount samples can be challenging. For decades, researchers hav...

2000
James Abello Jeffrey L. Korn

We describe MGV, an integrated visualization and exploration system for massive multi-digraph navigation. MGV’s only assumption is that the vertex set of the underlying digraph corresponds to the set of leaves of a predetermined tree T . MGV builds an out-of-core graph hierarchy and provides mechanisms to plug in arbitrary visual representations for each graph hierarchy slice. Navigation from o...

Journal: :Microelectronics Journal 2016
Giulia Beanato Alessandro Cevrero Giovanni De Micheli Yusuf Leblebici

3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The reduction in the number of 3D vias obtained with the adoption of serial vertical connections can relieve the routing congestion of the 3D system...

2012
Ismail Akturk Ozcan Ozturk

Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit area. An important issue in designing a heterogeneous 3D IC is reliability. To achieve this, one needs to select the data mapping and processor layout carefully. In this paper,...

نمودار تعداد نتایج جستجو در هر سال

با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید