نتایج جستجو برای: میکروفون خازنی mems

تعداد نتایج: 9672  

2009
A.H.M. Zahirul Alam Md. Rafiqul Islam Sheroz Khan Muhammad Mahbubur Rashid

Problem statement: In this study Microelectrical Mechanical System (MEMS) switches were proposed to design a reconfigurable/multi-band antenna to replaced PIN diode switches or semiconductor switches due to lower insertion losses, good isolation, much lower intermodulation distortion, and lower power consumption. The antenna is able to operate at very high frequencies. Approach: A reconfigurabl...

2005
Herbert R. Shea

With their extremely low mass and volume, low power consumption and tight integration with electronics, MEMS (microsystems) sensors and actuators are extremely appealing for reducing the size and mass of spacecraft without sacrificing functionality. In view of the harsh and remote environment of space, reliability and qualification is the crucial issues that are holding back MEMS from playing a...

2007
Clark T.-C. Nguyen

Having now produced devices with sufficient Q, thermal stability, aging stability, and manufacturability, vibrating RF MEMS technology is already finding its way into next generation timing and wireless applications. At this juncture, the technology is now poised to take its next logical steps: higher levels of circuit complexity and integration. In particular, as vibrating RF MEMS devices are ...

2017
G.Divya M.Vinothkumar

MEMS Oscillator design for high frequency application is approached in this project and its gain, noise and power are analyzed. The CMOS Micro Electro Mechanical System resonator structure is modeled using its RLC equivalent circuit where all passive components are extracted by COMSOL Mutiphysics tool. MEMS based oscillator requires to be combined with amplifier circuits to improve the performa...

2009
Julie Smith Darryl Sanchez Denis Oesch Nathan Engstrom Loretta Arguello Patrick Kelly

This paper is the 3rd in a series of papers discussing characterization of a Micro-Electrical-Mechanical-System (MEMS) deformable mirror in adaptive optics. Here we present a comparison between a conventional adaptive optics system using a Xinetics continuous face sheet deformable mirror with that of segmented MEMS deformable mirror. We intentionally designed the optical layout to mimic that of...

2006
Yung-Bin Lin Chih-Chen Lee Jin-Chong Chen Kuo-Chun Chang

Wireless MEMS sensors network has been widely used in many fields. In this paper the MEMS pressure sensor is integrated on a sensor board with Zigbee sensor network for real-time local bridge scour depth monitoring during a flood. The wireless MEMS pressure sensor scour monitoring system has been developed and tested in the laboratory. Local scour is one of the major factors for bridge failure....

2008
Sudhir Chandra Vivekanand Bhatt Ravindra Singh Preeti Sharma Prem Pal

In the present work, the deposition and characterization of dielectric, piezoelectric, semiconductor and conductor films by RF diode / RF magnetron sputtering process for applications in MEMS fabrication have been reported. Thin films of silicon dioxide, silicon nitride, amorphous silicon, zinc oxide and lanthanum doped lead zirconate titanate (PLZT) were prepared by RF sputtering process and e...

2009
Rohit Pathak Satyadhar Joshi Pawan Kotak

We have proposed a unified approach to the modeling and study of developments in the field of MEMS and Nanotechnology and its application in futuristic Nano-enabled Cells. We have proposed a novel to approach reliability of MEMS enabled fuel cells. We know that reliability and accurate prediction of properties in nano domains remains a major challenge where still theories are being developed to...

2000
Bikram Baidya

CMOS micromachining processes are being increasingly used to fabricate integrated MEMS devices. Verification of such designs requires extraction from layout to mixed domain circuits and MEMS schematics for lumped parameter simulation. The higher etch hole density and multilayer interconnect in CMOS-MEMS designs results in a larger and more complex problem than in polysilicon MEMS. In addition, ...

2013
Enrico Zio Piero Baraldi Yue Liu Bo Sun Qiang Feng

The package and interconnection are critical concerns that influence the reliability of MEMS sensors applied in modern automotive under random vibration conditions. This paper conducts a research on this problem to reveal the reliability and influencing factors of MEMS on board level using finite element modelling and random vibration response simulation method. The ADXL78 MEMS chip is used as ...

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