Chemical Mechanical Polishing (CMP) is currently being used in the fabrication of state-of-the-art integrated circuits, and has been identified as an enabling technology for the semiconductor industry in its drive toward gigabit chips and sub-130nm feature sizes. In this project we present the application of a library-based specular spectroscopic scatterometry method, which is capable of gettin...

cmp, a nucleotide sequence element in the plasmid pT181 of Staphylococcus aureus, acts as an enhancer of DNA replication. When cmp is present on an unrelated vector along with the pT181 origin of replication, it increases the ability of the linked pT181 origin to compete with a coresident pT181 plasmid for the initiator protein RepC. cmp is contained within a 156-base-pair segment, and its dele...

Chip Multi-Processor (CMP) has recently become a mainstream microprocessor. CMP’s allow multiple threads executing on a single processor chip at the same time, thus promise to deliver higher throughput performance. However, resource sharing among the threads executing on the same processor chip can cause conflicts and hurt the performance. Thus obtaining high performance and scalability on CMP ...

pT181, a 4.4-kilobase multicopy plasmid of Staphylococcus aureus, encodes a trans-acting initiator protein, RepC, which was rate limiting for replication. Deletions in a 500-base-pair region of the plasmid external to the minimal replicon decreased the ability of the plasmid to compete with a coexisting incompatible plasmid. These deletions, which define a region called cmp (for competition), a...

ion : Réutilisation : Légende : SI1 SI2 SIn te l-0 04 30 49 7, v er si on 2 4 Ja n 20 10 Chapitre 3 : Concepts de base et vue métier d’un composant métier processus 82 c) Origines de la variabilité Nous distinguons deux aspects qui peuvent être à l’origine de la variabilité représentée dans des CMP. 1. Variabilité des PM : un CMP modélise des PM similaires qui peuvent être déclinés de plusieurs...

This study observes that copper (Cu) films deposited by high current densities or in an aged electrolyte easily generate void defects after chemical mechanical polishing (CMP). The (111)/(200) ratio and the impurity amount of an electroplated Cu film are found to have strong correlation with the formation of void defects. Furthermore, pulse-reverse waveform plating following direct current plat...

The microelectronics industry is focused on increasing chip complexity, improving the density of electron carriers, and decreasing the dimensions of the interconnects into the sub-0.25 mum regime while maintaining high aspect ratios. Water-based chemical mechanical planarization or polishing (CMP) faces several technical and environmental challenges. Condensed CO2 has significant potential for ...

Along with the remarkable growth in complexity of semiconductor fabrication technology, chemical mechanical planarization (CMP) has evolved and become progressively more sophisticated over years, enabling implementation novel integration schemes. This paper discusses current research development trends one specific aspect CMP namely, ceria particle usage for advanced technology nodes provides s...

PURPOSE To examine the prevalence of refractive errors in children aged 3-6 years in China. METHODS Children were recruited for a trial of a home-based amblyopia screening kit in Guangzhou preschools, during which cycloplegic refractions were measured in both eyes of 2480 children. Cycloplegic refraction (from 3 to 4 drops of 1% cyclopentolate to ensure abolition of the light reflex) was meas...