نتایج جستجو برای: thermal contact resistance

تعداد نتایج: 735701  

Journal: : 2023

The influence of the structural material heat exchange pipes and contact thermal resistance transfer surface on intensity is considered. An approach to determination proposed. necessity taking into account in design exchangers shown

Journal: :Thermal science and engineering 2022

Contact thermal resistance is an important indicator of the efficiency heat transfer between contact interfaces.The interfaces superalloy GH4169 in high temperature was investigated byusing ANSYS. The real surface morphology obtained with optical microscope, and its modelwas reconstructed Based on theory structural mechanics, elastoplastic deformation microstructure interface simulated, analyze...

Journal: :IEEJ Transactions on Power and Energy 1985

Mazidi, , Mousapour, , Shojaeefard, ,

Thermal Contact Conductance (TCC) between an exhaust valve and its seat is one of the important parameters to be estimated in an internal combustion engine. An experimental study presented here to acquire temperature in some interior points to be used as inputs to an inverse analysis. An actual exhaust valve and its seat are utilized in a designed and constructed setup. Conjugate Gradient Metho...

Journal: :Axioms 2023

This paper considers the steady-state heat transfer process in a fin with Robin boundary condition at base (instead of usual Dirichlet base). models effect thermal resistance between and surface on which is placed. work presents an equivalent minimum principle, represented by convex coercive functional, ensuring solution’s existence uniqueness. In order to illustrate use proposed functional for...

Journal: :The Proceedings of the Thermal Engineering Conference 2020

Journal: :Journal of Thermophysics and Heat Transfer 2004

Journal: :iranian journal of chemistry and chemical engineering (ijcce) 2007
fatemeh dehghan nayeri behzad esfandiyarpour ashkan behnam ebrahim asl soleimani shamsodin mohajerzadeh

cu-mo and cu-ti contact structures were fabricated on multi-crystalline silicon substrates to provide a low resistance ohmic contact. deposition steps are done in an excellent vacuum chamber by means of electron beam evaporation and samples are then annealed for the realization of an efficient alloy layer. the effects of process parameters such as film thickness, annealing duration and temperat...

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