The package and interconnection are critical concerns that influence the reliability of MEMS sensors applied in modern automotive under random vibration conditions. This paper conducts a research on this problem to reveal the reliability and influencing factors of MEMS on board level using finite element modelling and random vibration response simulation method. The ADXL78 MEMS chip is used as ...

There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as t...

New Pb-free materials ask thorough verification because their properties as wetting, solderability and mechanical properties are different from these SnPb. In this paper are presented some new facts from creep and stress relaxation investigation including new arrangement for measurement. Results from creep, stress, shear and bend testing are presented for three types of solder (Sn/3.5Ag, Sn/3.8...

. Graduate Assistant, Ph.D candidate 2 . Corresponding Author, Professor, Dept. of Power Mechanical Engineering, National Tsing Hua University Abstract The flip chip packaging structure design and the fabrication process parameters will influence the packaging reliability and the performance of chip heat dissipation. The reliability of a flip chip package depends on the packaging structure desi...

With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-P WB system, accounting for ...

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape. The joints were exposed to isothermal fatigue, which was produced by a mechanical load t...

Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure ~MTTF! have been studied in the temperature range of 100 to 140 °C with current densities of 1.9 to 2.75 310 A/cm. In these joints, the under-bump-metallization ~UBM! on the chip side is a multilayer thin film of Al/Ni~V!/Cu, and the metallic bond-pad on the substrate side is a very thick, electroless Ni la...

1 Ph.D. Candidate 2 Corresponding Author, Professor Abstract Electromigration is a reliability concern of microelectronic interconnections, especially for flip chip solder bump with high current density applied. This study shows that with the line-to-bump geometry in a flip chip solder joint, the current density changes significantly between the Al trace and the bump, while the current crowding...

Much research work has been conducted into the cause of voiding and Henkel has studied in-depth the materials relationship to voiding. When using SAC alloys, in order to achieve the desired wetting and ultimate interconnection, the fluxes in the paste formulations have to operate at higher temperatures than those of their SnPb counterparts. Not only do the fluxes work harder, the SAC alloys als...