The thermal management of high heat fluxes is a critical roadblock in the way of higher-performance microelectronics. The ongoing reduction in microtransistor size translates into heat fluxes comparable to those encountered in nuclear reactions and rocket nozzles, but under much severer temperature constraints. Although the average heat flux may remain in the vicinity of 100 to 300 W/cm, the pe...

A two-point second-order uniform box scheme and effective regularization algorithm have been developed for numerical analysis of the gas flow in the boundary layer (BL) and thin viscous shock layers (TVSL) under conditions of intensive blowing on the body surface and chemical reactions. Flowfield parameters in the boundary layer near the stagnation point of a blunt body were calculated for vari...