Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies. However, many factors decrease the number of the actually packaged dies, such as die scratching, die contamination, and die breakage, which are not considered in the existing die-counting method...

At present, mills producing structural timber generally undertake strength grading at the end of the production process, i.e., after buying the material and sawing it into timber which is then dried. This means that any variation in wood stiffness between forest stands and between trees is unknown and unaccounted for until the end of the manufacturing process. Portable stress-wavebased tools pr...

Grinding of various materials is carried out in ways: cutting, crushing, sawing, breaking, hitting.
 In the technological equipment meat processing plants, grinding achieved by a combination several types mechanical action. Each type characterized an average particle size, while large, medium, fine, ultrafine (colloidal grinding) used.
 A block diagram and products has been compiled, ...