The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this research were to produce and demonstrate the efficiency of the passive cooling technology (heat pipe) integrated in a very thin electronic substrate that is a part of a multifunctional 3-D electronic package. The enhanced t...

The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this research were to produce and demonstrate the efficiency of the passive cooling technology (heat pipe) integrated in a very thin electronic substrate that is a part of a multifunctional 3-D electronic package. The enhanced t...

An underdeveloped class of oscillatory passive heat transport cycles are discussed that have the potential to transport significantly higher heat loads than current heat pipes. Prototype cycles employing inferior working fluids have demonstrated transport of higher heat loads over significantly greater distances than similarly sized heat pipes (including CPLs and LHPs) employing ammonia. Most o...

Abstarct: Flow through pipes and heating situations find wide applications in industry. Depending on the fluid properties, temperature field in the pipe changes. This in turn results in thermodynamic irreversibility in the flow system. Thermodynamic irreversibility can be quantified through amount of entropy generation in the thermal system. Consequently, in the present study, the influence of ...

This paper presents recent advances in a number of novel, high-performance cooling techniques for emerging electronics applications. Critical enabling thermal management technologies covered include microchannel transport and micropumps, jet impingement, miniature flat heat pipes, transient phase change energy storage systems, piezoelectric fans, and prediction of interface contact conductance....