Abstract:Electroless Nickel-phosphorus (EN) coatings provide high performance in various industrial fields due to their unique properties such as excellent corrosion and wear resistance. This paper aims to study the effect of ZnO nano-particles addition on corrosion behavior of EN coatings. Various amounts of ZnO nano-particles with average diameter of 50 nm were added to hypophosphite reduced ...

Rhenium Re –Me alloys where Me = Ni, Fe, or Co were deposited galvanostatically. The plating bath consisted of ammonium perrhenate, nickel or cobalt sulfamate, or iron sulfate, citric acid, and magnesium sulfamate. The effects of bath chemistry and deposition time on faradaic efficiency FE , Re content, and partial deposition currents were determined. Rhenium contents as high as 93 atom % or FE...

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na₂SO₄ was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates wer...

Carbon nanotubes (CNTs) have high aspect ratio and have great potential to be applied as the field emission cathode because of its large field enhancement factor. In this work, a high performance carbon nanotube field emission cathode (CNTFC) was fabricated by using a composite plating method. The CNTs were purified by acid solutions and then dispersed in electrobath with nickel ions at tempera...

This paper describes the interaction of the NEMI recommended lead-free solder for reflow assembly (Sn3.8Ag0.7Cu) with different commercial printed wiring board (PWB) platings. It also discusses the effects of plating type and manufacturer on the strength of the lead-free solder joints. PWBs from two different manufacturers with the same four types of plating were examined. The platings were org...

This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...