To preserve the structural integrity of power semiconductor devices, ensuring a reliable connection between wide-bandgap (WBG) chips and their substrates at temperatures above 200 °C is crucial. Therefore, easily processable chip-attach materials with high bonding strengths should be developed. Herein, we determined optimal pre-heating conditions to achieve highly WBG devices. Sintering silver-...

the absorption properties of charge transfer organic semiconductor ttf-tcnq (tetrathiafulvalene-tetracyanoquhodimete ) filmsdeposited on kbr singlecrystal, quartz and glass substrates in far infrared have been investigated. an absorption edge at ?10 ??m was observed. photoconductivity, photoconduction efficiency and gain and photocarrier's lifetime have been measured. the results show an e...

abstractin this work, the micro powder was the product of cedar leaf (mpcl) is used as a low-cost adsorbent for the removal of pb2+ ions from aqueous solutions. bath experiments were used to determine the best adsorption conditions the adsorption percentage of pb2+ ions mpcl samples at different initial ph, contact time (tc), adsorbent dosage and temperature (t) were investigated. effective rem...

A moving finite element-based inverse method for determining the temperature on a moving surface is developed. The moving mesh is generated employing the transfinite mapping technique. The proposed algorithms are used in the estimation of surface temperature on a moving boundary with high velocity in the burning process of a homogenous low thermal diffusivity solid fuel. The measurements obtain...