The most important parameter in transformers life expectancy is the hot-spot temperature level which accelerates the rate of aging of the insulation. The aim of this paper is to present thermal models for transformers loaded at prefabricated MV/LV transformer substations and outdoor situations. The hot-spot temperature of transformers is studied using their top-oil temperature rise models. The ...

The moisture absorption behavior and the influence of moisture on thermal and mechanical properties of glass–fiber/polyetherimide (PEI) laminates have been investigated. The laminates were exposed to hydrothermal aging at two different temperatures and high moisture rates. The properties of as-received and hydrothermally aged samples were compared. The hydrothermally aged laminates contained a ...

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Ni/Au-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...

This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because of their slower reaction rates with Sn-based solder as compared to Cu-based UBMs. In this study, we compared the morphologies of the intermetallic compounds (IMC) formed between Sn-bearing solders...