Liquid-cooled hot plates require effective thermal management which can be accomplished by implementing appropriate cooling architectures. This investigation is about high heat-generating systems and reports the performance of heated with various flow configurations: Serpentine flow, parallel tubes two tree-shape systems. Single double objectives size constraint are studied to obtain best desig...

Heat sink or heat exchanger is a passive cooling device used in electronic components to prolong their longevity, performance and reliability. All utilize current for the operational purposes thus become prone sharp increase temperature. The generated above operating level becomes critical in-terms of failure component hence, appropriate thermal management demands come into act. Finned extended...

The pressure drop and heat transfer characteristics of a single-phase micro-channel heat sink were investigated both experimentally and numerically. The heat sink was fabricated from oxygen-free copper and fitted with a polycarbonate plastic cover plate. The heat sink consisted of an array of rectangular micro-channels 231 lm wide and 713 lm deep. Deionized water was employed as the cooling liq...

At present, most of the electronic components are cooled by means of heat sinks attached to them and by blowing air with fans. Unfortunately, this technique does not allow removing very high power without the heat sinks size becoming bulky or the fan becoming too large. An even bigger limitation of direct air-cooling appears when dealing with high heat fluxes, which are common since the chips’ ...