In the present paper, we will study examples of settlement excavations that can sometimes reveal abundant gold material. These underwater excavations took place in Alexandria and Aboukir Bay, Egypt, where we found numerous gold or gold-plated objects. Of these, some objects provide us with information about the trade routes used in those times, and others show us that refinement existed even du...

In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability bumps, which plays role in mechanical support, electrical connection, signal transmission heat dissipation, determines quality packaging. Surface morphological defects are one main factors affecting closely related to materials bonding process parameters. th...

Thallium is used in both cyanide and sulfite-based gold plating bath solutions as an additive that modulates how deposits on the target substrate. The level of Tl has a large effect properties being deposited, including its microstructure hardness. Thus, especially commercial process applications, it critical to be able measure content accurately, quickly, facilely order ensure proper quality p...

An electrochemical immunosensor based on screen-printed gold working electrode with onboard carbon counter and silver-silver chloride pseudo-reference electrode for Salmonella typhimurium detection is described in this paper. Monoclonal anti-S. typhimurium antibody was immobilized using physical and covalent immobilization via amine coupling of carboxymethyldextran on the surface of the gold wo...