Femtosecond laser micromachining of glass material using low-energy, sub-ablation threshold pulses find numerous applications in the fields of integrated optics, lab-on-a-chips and microsystems in general. In this paper, we study the influence of the laser-deposited energy on the performance of the micromachining process. In particular, we show that the energy deposited in the substrate affects...

Porous silicon samples were prepared by electrochemical etching method for different etching times. The structural properties of porous silicon (PS) samples were determined from the Atomic Force Microscopy (AFM) measurements. The surface mean root square roughness (σ rms) changes as function of porosity were studied, and the influence of etching time on porosity and roughness was studied too. U...

This paper shows that the reflectance in silicon nanowires (SiNWs) can be optimized as a function of the area of silicon substrate where the nanostructure growth. SiNWs were fabricated over four different areas of silicon substrates to study the size effects using electroless etching technique. Three different etching solution concentrations of silver nitrate (AgNO3) and hydroflu...

The etching of SiO2 layers from silicon surfaces is one of the most critical steps in wet processing technology. Although numerous studies have been performed to analyze the mechanisms and kinetics of these processes, little attention has been given to monitoring and controlling the chemical concentrations in the process baths. Chemical concentration control is becoming crucial to wafer process...

PURPOSE More than five hundred million direct dental restorations are placed each year worldwide. In about 55% of the cases, resin composites or compomers are used, and in 45% amalgam. The longevity of posterior resin restorations is well documented. However, data on resin composites that are placed without enamel/dentin conditioning and resin composites placed with self-etching adhesive system...

The etching of silicon nitride (Si3N4) and silicon dioxide (SiO2) in the afterglow of NF3 and NF3 /O2 microwave discharges has been characterized. The etch rates of both materials increase approximately linearly with the flow of NF3 due to the increased availability of F atoms. The etch rate of Si3N4 is enhanced significantly upon O2 injection into the NF3 discharge for O2 /NF3 ratios of 0.3 an...

Femtosecond laser micromachining is becoming an established technique for the fabrication of complex three-dimensional structures in glass. The combination writing and chemical etching increases versatility by allowing hollow within bulk material. possibility to encompass both optical fluidic components a single substrate allows us realize optofluidic devices usable several application fields. ...