Establishment of signal integrity over a broad band as well as suppression of electromagnetic coupling between wirings in ICs are significant problem, because packaging density in ICs is very high. To clarify the electromagnetic compatibility (EMC) problems that related to the interconnection in the IC chip, transmission characteristics and electromagnetic coupling between wirings in the specia...

Electromagnetic compatibility testing presents a challenging environment for an amplifier as the must operate continuously into load impedances that can vary widely while still meeting its performance ratings. The AR RF/Microwave Instrumentation’s Universal U series is family of amplifiers designed to withstand these challenges and provide flexibility when used in applications. series’ extensiv...

Electromagnetic compatibility (EMC) analysis of high-speed circuits is mandatory due to the rapid increase in operating frequencies, RF interference and PCB layout density. Radiated emission and immunity tests of electronic circuits and ICs are an important part of the overall EMC analysis and they have become a growing concern in prediction of an electronic system reliability. These tests are ...

This paper presents the design and fabrication of an open TEM cell. It allows you to measure radiated emission immunity radioelectronic devices. The size EUT should not exceed 184×162×30 mm. Performed analytical quasi-static analysis regular part In frequency range up 1.4 GHz reflection coefficient |S11| does minus 45 dB. electrodynamic model cell is developed geometric parameters are optimized...