in the past 30 years, electroless nickel (en) plating has grown to such proportions that these coatingsand their applications are now found underground, in outer space, and in a myriad of areas inbetween. moreover, in order to further improve the mechanical and tribological properties of thenickel-phosphorous (ni-p) coatings, ni-p/ptfe composite coatings can be obtained, which provideseven grea...

This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallization) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. Typically, UBM is deposited on the whole wafers by spu...

In this study, multi wall carbon nanotubes (MWCNTs) were synthesized by Chemical vapor deposition (CVD) method using two different catalysts (Fe nanoparticles) and (Ni nanoparticles) with  two different substrates: Quartz and Alumina. Acetylene gas was used as a carbon source and Argon as a carrier gas at different temperatures and different times to study the effects of these parameters on CNT...

In this study, multi wall carbon nanotubes (MWCNTs) were synthesized by Chemical vapor deposition (CVD) method using two different catalysts (Fe nanoparticles) and (Ni nanoparticles) with  two different substrates: Quartz and Alumina. Acetylene gas was used as a carbon source and Argon as a carrier gas at different temperatures and different times to study the effects of these parameters on CNT...

Abstract: Electroless Nickel (EN) composite coatings embedded with Cr2O3 and/or MoS2 particles were deposited to combine the characters of both Cr2O3 and MoS2 into one coating in this study. The effects of the co-deposited particles on corrosion behavior of the coating in 3.5% NaCl media were investigated. The results showed that both Ni-P and Ni-P composite coatings had significant improvement...

This paper describes the use of area-selective electroless Cu deposition for topography control Cu-SiCN hybrid bonding pads. The allows one to obtain protrusions on pads without further polishing optimization. A recessed pad after chemical mechanical becomes a protrusion deposition. indicates that film was selectively deposited Cu, SiCN surface. void-free Cu-Cu interface observed annealing at 3...

In this work the effects of various methods of agitation on the properties of electroless Ni-P-MoS2 composite coatings were investigated. Magnetic stirring as well as purging the solution with gas (Air, Oxygen, Nitrogen) were used. Plating rate, chemical composition, MoS2 distribution, and hardness of the deposit were measured. Topography of coating was studied with metallography and scanning e...