An experimental study was carried out of photovoltaic effects occurring in the structure Cu/CuTCNQ/ITO(A1). Prototype devices were fabricated by growing CuTCNQ organic thin films directly on a copper substrate and then laying the semitransparent electrodes (glass/ITO or glass/Al) on the CuTCNQ/Cu. By choosing appropriate conditions for formation of the film in the liquid phase, for example solu...

This paper reports on the measurement of elastic modulus of thin film materials by a magnetostrictive sensor. Thin film materials of Cu, Cr, Al, Au, Sn, In, Au-rich lead free solder (AuSn) and SiC were sputter deposited onto well defined strips of Metglas sensor. The elastic modulus of the thin film materials was determined by measuring the resonant frequency of the sensors before and after fil...

a  commercial  ti-nanoxide  was  deposited  on  in-doped  sno2 (ito) polymer  substrates by  tape casting  technique with different thicknesses  (7,  14  and  36μm)  to  be  used  as  photoelectrode  in flexible  dye-sensitized  solar  cells  (dsscs).  ruthenium  dye  was adsorbed on each tio2 film for 24 h. the resulting photoelectrodes were used to form flexible dsscs in combination with elec...

co-fe films were electrodeposited on cu substrate from electrolytes with different co concentration  levels. x-ray diffraction (xrd) was used  to  investigate  the  films  crystal  structures. the  results  indicate that  if  the  co  concentration  is  less  that  the  fe  concentration,  the cubic  structure  appears  in  the  films, while  the  hexagonal  structure dominates when  the co  co...

Thin-film transistor circuits on flexible substrates hold major promise for next-generation human–machine interface systems. However, a bottleneck is the reliability of interconnect, which prone to open-circuit faults due mechanical, electrical, and environmental stresses. Here, self-healing interconnects in thin-film are demonstrated resulting restoration >99% prefault current. The active mate...

A view of contemporary systems and control challenges in PV cell manufacturing is given in this paper, with emphasis on developing a modeling strategy for the optimization of thin-film silicon nitride SiNx:H films used for passivation and anti-reflection coatings in single (sc-) and multicrystalline silicon (mc-Si) solar cells. The overall framework integrates three modeling modules: a remote p...

Abstract An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly structures on large glass substrates using LCD manufacturing equipment. Trace widths of 5 microns and a trace pitch of 10 microns are achievable on flexible substrates as large as 1800 x 1500 mm. Back planes for d...

in this paper, the electrochemical behaviour of passive films formed on aisi 321 stainless steel (aisi 321)immersed in 0.1 m naoh + 0.1 m koh solution was evaluated by different electrochemical techniques. forthis purpose, passive films were formed at open circuit potential for 1 to 12 hours and then electrochemicalmeasurements were done. the polarization curves suggested that aisi 321 showed e...

In this study about the relationships between structural and microwave electrical properties of KTa(1-x)NbxO3 (KTN) ferroelectric materials, a KTN thin film was deposited on different substrates to investigate how KTN growth affects the microwave behavior. Interdigital capacitors and stubs were made on these films through a simple engraving process. Microwave measurements under a static electri...