important aspect of computer design, with device performance being significantly affected by temperature. In addition, device lifetime can be decreased drastically because of large thermal stresses that occur especially at interfaces. The ability of a structure to remove heat is best quantified by its thermal resistance, which is given by the temperature difference divided by input power. In mi...

LaCl₃ doped polycrystalline SnSe was synthesized by combining mechanical alloying (MA) process with spark plasma sintering (SPS). It is found that the electrical conductivity is enhanced after doping due to the increased carrier concentration and carrier mobility, resulting in optimization of the power factor at 750 K combing with a large Seebeck coefficient over 300 Μvk-1. Meanwhile, all the s...

This paper contains new, representative equations for the thermal conductivity of normal and parahydrogen. The equations are based in part upon a body of experimental data that has been critically assessed for internal consistency and for agreement with theory whenever possible. Although there are sufficient data at normal temperatures, data at very low or very high temperatures as well as near...

Theoretical model for predicting effective thermal conductivity (ETC) of metal filled polymer composites has been developed. The concept of averaging the temperature field within different phases has been used. Resistor model has been applied to determine ETC of polymer composites. A parameter estimation technique has been applied to determine the inclination angle θ. An effort has been made to...

In this work, thermal transport in nanocrystalline materials is studied using large-scale equilibrium molecular dynamics simulation. Nanocrystalline materials with different grain sizes are studied to explore how and to what extent the size of nanograins affects the thermal conductivity and specific heat. Substantial thermal conductivity reduction is observed and the reduction is stronger for n...

An analytic robust model is developed for estimating GDL thermal conductivity. The model considers PTFE addition to the GDL. Thermal conductivity of MPL is accurately measured in a compression range of 2e14 bar. Effect of thermal conductivity on PTFE, MPL, and compression is considered. Thermal contact resistances between GDL and MPL/iron surface are measured. a r t i c l e i n f o

An industrial ceramic thermal-barrier coating designated PWA 266, processed by electron-beam physical-vapor deposition, was measured using a steady-state thermal conductivity technique. The thermal conductivity of the mass fraction 7 % yttria-stabilized zirconia coating was measured from 100 °C to 900 °C. Measurements on three thicknesses of coatings, 170 μm, 350 μm, and 510 μm resulted in ther...

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that b...

The thermal conductivity of group-IV semiconductors (silicon, germanium, diamond and grey tin) with several isotopic compositions has been calculated from a kinetic-collective model. From this approach, significantly different to Callaway-like models in its physical interpretation, the thermal conductivity expression accounts for a transition from a kinetic (individual phonon transport) to a co...

Thermal rectification is a phenomenon in which transport is preferred in one direction over the opposite. Though observations of thermal rectification have been elusive, it could be useful in many applications such as thermal management of electronics and improvement of thermoelectric devices. The current work explores the possibility of thermally rectifying devices with the use of nanostructur...